Aptasic
Switzerland
Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.
Services
Consulting
- DfX: design for test (DfT), design for manufacturing (DfM), design for assembly (DfA)
- Project management
Electrical Test Implementation
- Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio frequency (RF)
- Multi-site wafer probing at cold/room/hot temperature (-40C / 150C)
- Parallel package test at cold/room/hot temperature (-40C / 150C)
Screening and Qualification
- Full range of procedures accordingly to JEDEC / MIL-883 standards
Industrialization
- Prototyping of small series (using ProtoPack)
- Production ramp-up optimization
- Manufacturing in mass production
- Tape and reel (T&R)
Wafer Supply
- Supply from major fab’s
- Inventory & forecast management
- Safety stock management
Manufacturing
- Wafer level chip scale packages (WLCSP) with RDL, passivation and bumping
- Back-grinding, sawing, wafer molding
- Standard (lead-less and leaded) packages: DFN, QFN, QFP, TQFP, LQFP, MSOP, QSOP, SOIC-N, SOIC-W, TSSOP-4.4,TSSOP-6.1, SSOP, PDIP, PLCC.
- Laminate substrate packages: BGA, LGA.
- Discrete packages: SOT-23, SOT143, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323.
- Specific packages: TO-220, DDPACK, Clear pkgs, PSOP.
- Multi die packages: Stacked, Flip-chip, Multi chips, System in Package (SIP), Specific custom package development,
- PCBA and COB modules.
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