Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.





  • DfX: design for test (DfT), design for manufacturing (DfM), design for assembly (DfA)
  • Project management

Electrical Test Implementation

  • Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio frequency (RF)
  • Multi-site wafer probing at cold/room/hot temperature (-40C / 150C)
  • Parallel package test at cold/room/hot temperature (-40C / 150C)

Screening and Qualification

  • Full range of procedures accordingly to JEDEC / MIL-883 standards


  • Prototyping of small series (using ProtoPack)
  • Production ramp-up optimization
  • Manufacturing in mass production
  • Tape and reel (T&R)

Wafer Supply

  • Supply from major fab’s
  • Inventory & forecast management
  • Safety stock management


  • Wafer level chip scale packages (WLCSP) with RDL, passivation and bumping
  • Back-grinding, sawing, wafer molding
  • Standard (lead-less and leaded) packages: DFN, QFN, QFP, TQFP, LQFP, MSOP, QSOP, SOIC-N, SOIC-W, TSSOP-4.4,TSSOP-6.1, SSOP, PDIP, PLCC.
  • Laminate substrate packages: BGA, LGA.
  • Discrete packages: SOT-23, SOT143, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323.
  • Specific packages: TO-220, DDPACK, Clear pkgs, PSOP.
  • Multi die packages: Stacked, Flip-chip, Multi chips, System in Package (SIP), Specific custom package development,
  • PCBA and COB modules.