Beckermus Technologies

Beckermus Technologies has more than 20 years of experience in providing micro-assembly services in the fields of microelectronics, micro-optics and photonics.

In Beckermus, there is no minimum order quantity, we support our clients from the very first steps of prototyping through small amounts assembly and up to mid-high quantities.

Our microelectronics services include the following IC assembly technologies and applications:

• Wire bonding
• Die attach -CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL, Laser diodes, microcontrollers and more
• Flip chip
• Encapsulation
• Chip on board/Chip on flex
• System in packages (SiP) and Multi-chip module (MCM)
• Wafer level packaging
• 3D stacked dies
• Wafer dicing/sorting

Our Micro optics/photonics assembly services:

• Optical modules assembly
• Active alignment
• Electro optics and photonics assembly

Our clean room includes 7 workspaces and over 60 workstations, spreading on ~700 square meters. Our facilities received class ISO 7/6/5 certifications and ISO 13485: Medical devices, AS9100D aerospace, QMS certified, IPC-A-610 and MILL-STD 883 qualifications.