Global
Cyient Semiconductors is a fabless semiconductor company delivering custom ASICs, ASSPs, and custom products with strong expertise in analog, mixed-signal, and intelligent power architectures. The company provides end-to-end design and development services, spanning system architecture, RTL-to-GDSII implementation, verification, physical design, DFT, embedded software, and post-silicon validation—enabling a seamless spec-to-silicon approach.
With deep engineering expertise and a focus on execution, Cyient Semiconductors helps customers accelerate innovation, reduce design complexity, and bring high-performance, power-efficient products to market faster. Its solutions support a wide range of applications across high-performance computing, AI, automotive, industrial automation, robotics, communications, and healthcare.
Backed by a global engineering footprint and strong ecosystem partnerships with leading foundries and OSAT providers, Cyient Semiconductors ensures scalable, high-quality silicon development from design through production.
Cyient Semiconductors provides full turnkey ASIC services, acting as a single accountability partner across the entire silicon lifecycle. From early system definition and feasibility analysis through high‑volume production, the company integrates design, manufacturing, test, and supply‑chain management under one cohesive program framework.
Turnkey engagements include architecture definition, front‑end and back‑end design, verification, DFT, embedded software, and post‑silicon bring‑up, combined with foundry interfacing, OSAT coordination, and qualification management. Customers benefit from simplified vendor management, predictable execution, and tighter control over cost, schedule, and quality.
By leveraging long‑standing relationships with global fabrication and packaging partners, Cyient Semiconductors ensures access to advanced process nodes, proven packaging technologies, and scalable manufacturing capacity. This turnkey model is ideally suited for customers seeking reduced risk, faster time‑to‑market, and a trusted partner to manage the complexity of modern ASIC programs.
Cyient Semiconductors supports ASIC development from system architecture through detailed front‑end implementation. Services include requirements analysis, system modeling, micro‑architecture definition, RTL development, low‑power design techniques, and clock/reset strategy.
The team has extensive experience delivering complex SoCs, ASSPs, and subsystem designs, incorporating digital, analog, mixed‑signal, and power‑management blocks. Emphasis is placed on design reuse, configurability, and scalability to support evolving product roadmaps.
Design flows are aligned with customer specifications and industry‑standard methodologies, enabling seamless collaboration and traceability throughout the development lifecycle.
Cyient Semiconductors provides end‑to‑end physical design services, including floorplanning, place‑and‑route, timing closure, power analysis, signal‑integrity verification, and GDSII sign‑off.
Teams are experienced across multiple technology nodes and process variants, supporting performance‑, power‑, and area‑optimized layouts for complex designs. Advanced methodologies are applied to address congestion, reliability, thermal management, and manufacturability challenges.
Physical design services are tightly integrated with front‑end, verification, and DFT teams to ensure first‑silicon success and efficient design closure.
Comprehensive verification services cover functional, formal, and system‑level verification, using industry‑standard methodologies such as UVM and coverage‑driven verification.
Cyient Semiconductors also provides complete Design‑for‑Test (DFT) solutions, including scan insertion, ATPG, boundary scan, and built‑in self‑test (BIST). Verification and DFT strategies are aligned early in the design cycle to minimize rework and improve test coverage.
Robust sign‑off flows ensure design quality, compliance with foundry requirements, and readiness for tape‑out.
Operating within a fabless model, Cyient Semiconductors manages the downstream phases of silicon realization, including foundry engagement, mask management, wafer fabrication, packaging, and test.
The company coordinates engineering and production test development, qualification planning, and yield monitoring, working closely with OSAT and manufacturing partners. This integrated approach ensures smooth transition from engineering samples to volume production.
Customers benefit from transparent program management, quality oversight, and scalable manufacturing readiness without the burden of direct supply‑chain complexity.
Cyient Semiconductors provides strong program management and supply‑chain integration across global, multi‑partner ecosystems.
Dedicated program teams orchestrate cross‑functional execution, manage risks, and maintain alignment across engineering, manufacturing, and customer stakeholders.
This integration‑led approach enables predictable execution, faster issue resolution, and improved lifecycle management for complex ASIC engagements.
(Integration & enablement only – no standalone IP licensing)
Cyient Semiconductors supports the selection, integration, and validation of third‑party IP from leading ecosystem partners. Services include IP evaluation, interoperability analysis, integration into SoC architectures, verification, and lifecycle management.
The focus is on de‑risking IP usage, ensuring design compatibility, and accelerating time‑to‑market within turnkey ASIC programs.
Cyient Semiconductors enables customers to integrate industry-standard interface subsystems into complex SoCs and custom ASICs as part of turnkey programs. The focus is on integration, verification, and silicon bring-up rather than standalone IP licensing. Typical engagements include selection support for proven third-party IP, integration of controllers and PHYs into the system architecture, definition of clocks/resets and power states, and creation of integration collateral (register maps, integration guides, and connectivity checklists).
The team supports interoperability and compliance-driven flows by building robust verification environments, running protocol- and system-level simulations, and driving coverage closure. Integration is aligned with DFT, physical design, and sign-off requirements to reduce late-stage surprises and improve first-silicon success. When needed, Cyient Semiconductors also supports post-silicon validation and debug, including board-level bring-up and test content development in collaboration with ATE and manufacturing partners.
This capability helps customers accelerate schedules, minimize integration risk, and ensure that interface subsystems meet performance, power, and reliability targets across the full chip lifecycle—from architecture to production readiness.