Digicomm Semiconductor

India

Established in 2012, Digicomm Semiconductor is a premier technology partner specializing in end-to-end silicon design and embedded software solutions. Headquartered in Bangalore’s Whitefield tech corridor with a strategic presence in San Jose, California, the firm excels at bridging the gap between complex architectural concepts and successful silicon tape-outs.

 

The company’s core competencies span the entire VLSI spectrum, including high-complexity ASIC/SoC design, UVM-based verification, and physical design sign-off at advanced process nodes. Digicomm distinguishes itself through deep domain expertise in high-speed SerDes interfaces and functional safety-critical embedded systems, particularly within the automotive and ADAS sectors. Their engineering teams are proficient in industry-standard toolchains from Cadence, Synopsys, and Siemens, ensuring seamless integration into global semiconductor workflows.

 

By prioritizing technical excellence and rigorous quality standards, Digicomm serves as a trusted collaborator for global fabless companies and system OEMs. Whether delivering turnkey projects or providing specialized engineering teams, the company is dedicated to accelerating product lifecycles and mitigating risk in the most demanding silicon environments. This commitment to engineering precision positions Digicomm as a pivotal player in the global semiconductor ecosystem.

Services

RTL Design and Verification

  • Spec to uArchitecture details Prototyping
  • RTL Implementation SDC
  • Lint, CDC and UPF
  • Power Partitioning Chip Integration

Design Verification

  • Design Verification
  • SV & UVM expertise SoC/ IP Verification
  • BFM, TB, & Env Development Gate Level Simulations Formal Verification
  • Coverage analysis Functional coverage

Design For Test

  • DFT Architecture Scan Insertion ATPG
  • MBIST
  • Test Mode Timing DC / DFT Compiler
  • TestKompress, Tetramax

Physical Design

  • 3nm, 5nm, 7nm, 16nm Expertise Top Level /Block level PD
  • Low Power Implementation
  • Design Partitioning/ Floor Plan/ Place & Route Synthesis
  • SI and Power Analysis Physical Verification

Static Timing Analysis

  • Constraint/Budgeting Timing & DRC Checks
  • Timing Analysis at Block, Top, IO Level
  • Handoff to Cross-functional Team
  • ECO Handoff to PNR Team

Post Silicon Validation

  • Peripheral, Module, & SOC Level Environment & Chip Bring Up           
  • Functional & Compliance Testing Characterization across:
  • Power,Performance, & Thermal
  • MISRA-C
  • Functional Safety ISO26262 Automotive ASPICE
  • ASIL
  • Agile, V-Model
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