EquipIC Supply Chain

Typical foundry services like MPW, MLM, full mask based wafer manufacturing for all common foundries like TSMC, UMC, Globalfoundries, Tower-Jazz, X-fab, AMS etc etc. EquipIC has production in multiple fabs and can therefore leverage also small volume products there.

EquipIC suggest early involvement in foundry selection process since overall costs are often driven by the IP solutions (physical IP is typically specific to a foundry technology!), so foundry and IP selection are related.

Common package solutions like leadframe or substrate based packages (corresponding to QFN, BGA type package) as well as wafer level packaging types based on bumping, PoP, TSV. We have special expertise in MCM packaging that achieve smallest footprint und allow to pre-certify solutions in fields where this is required.

EquipIC provides test solutions typically based on Terdyne testers (J750 or Flex-Family), both for wafer level and final test (for packaged devices). EquipIC has some nice success stories of RF and mixed-signal test solutions that can be demonstrated. EquipIC suggests early implication at design stage on DFT (design for test) and DFM (design for manufacturing) that is often neglected but DOES make the difference if low PPM numbers are needed and test development should be smooth.

EquipIC also offers to manage 3^rd parties supply chains or to provide only partial supply chain related services, so that customers can concentrate on their technology innovations, product developments and marketing.