HCM.SYSTREL (SERMA Group) produces high reliability components such as SCM, MCM & custom hermetic packages, according to MIL and Aerospace specifications.

With over 30 years of experience and a certified quality system, we provide global back-end services (wafer sawing, dice visual inspection, assembly and test) for a wide range of devices, from bare dies and wafer to qualified components, for obsolete, reengineered or customized ASIC components.

Merging our microelectronics know-how with a last generation of surface mounted technology (SMT) line, we also address high density hybrid technologies.


Wafer Treatment

  • Wafer sawing / Wafer dicing
  • Wafer thinning / Wafer grinding / Wafer backlapping
  • Wafer storage (under nitrogen) in secure cabinets
  • Die management and logistics
  • Loading in Waffle pack / gel pack
  • Dice visual inspection vs MIL-STD-883 / MIL-STD-750 / ESCC2049000
  • EWS testing / Wafer probing
  • Die cleansing

Assembly Services

  • Die attach (glue, eutectic, soft solder, silver sintering)
  • Wirebonding (gold ball, wedge Au/Al, Copper ball, different wire size, heavy wire for power applications)
  • Flip chip
  • Sealing (AuSn hot solder, seam welding, sealing under vacuum)
  • SMT devices mounting (using reflow)
  • COB (Chip-on-Board)

Ball / Column Attachment

  • BGA Balling / rework (PbSn, lead free)
  • Copper wrapped PbSn column manufacturing
  • Column attachment on lands substrate

Hybrids Design and Manufacturing

  • Ceramics thick films substrates
  • Resistive layers laser adjustment
  • Laser cutting
  • Hybrids design for manufacturing (DFM)
  • Qualification lots and final delivery

Full Back-end Turnkey Solution

  • Wafer probing
  • Wafer sawing
  • Dice visual inspection
  • Hermetic assembly
  • Electrical and environmental screening
  • Lot qualification
  • Qualified models delivery
  • All done in house (vs MIL or ESCC quality level)
  • Type of devices: actives, IC, ASIC, MMIC, MEMS, image detectors …

Environmental Test and Lab Analysis

  • PIND test
  • Seal test
  • X-Rays / Tomography
  • Constant acceleration / Vibration / Mechanical Shocks
  • ESD test / latchup / Electromigration
  • HTOL / Burnin / HAST / THB / Thermal cycling / Thermal shocks
  • Laser Marking
  • Failure analysi