USA
IC Failure Analysis Lab’s skilled and experienced team and state-of-the-art equipment enable us to provide industry leading techniques to resolve your problems. Our services include but not limited to 2 & 3D X-Ray, Curve Tracing, SEM, EDX, SAM, FIB, X-Sectioning, Photo Emission (OBRICH / EMMI), Secondary Ion Mass Spectrometry (SIMS), TEM and Reverse Engineering.