IMMS GmbH
Germany
We are an X-FAB premium partner with a 25-year track record in ASIC design and test. We offer deep research and application expertise in biomedical and optical sensors (e.g. SPAD or imagers), as well as passive sensor operation via RFID/NFC.
Together with you, we find the perfect match between performance, operating conditions, and manufacturing costs. We balance accuracy, bandwidth, power consumption, chip size, and select the best technology for your analog, digital, or mixed-signal IC. Thanks to a close collaboration between our design, verification, layout, and test engineers as well as with our colleagues from X-FAB, we achieve first-time-right silicon.
We also test, characterize, and qualify your (integrated) circuits, sensors and systems with our excellent pool of measurement equipment, even for small series. We develop individual test environments or demonstrators for your ASIC, including test software, test hardware, optics, fluidics etc.
In addition, we develop new methods and tools for your system-on-chip and FPGA designs to master the demand for increasing complexity and performance.
Services
ASIC Design
Within our IC design team, we have specialists for:
-analog circuit design
-digital circuit design
-mixed-signal verification
-IC layout
-Opto electronics
-radio-frequency technology
We offer the following ASIC design services:
-Concept and feasibility studies
-System modeling and simulation
-Analog, digital and mixed-signal design
-Analog, digital and mixed-signal verification
-Layout design
-Synthesis and place-and-route
-FPGA and virtual prototyping
-Automatic Test Pattern Generation (ATPG)
Our portfolio includes the design and realization of:
-Integrated sensors
-Integrated optical receivers
-Precision amplifiers
-Control loops
-Clocked circuits
-Digital interfaces
-Complex sequence and state controllers
-Radiofrequency (RF) circuit up to 5 GHz
-High-voltage (HV) circuits up to 200 V
-High-temperature (HT) circuits upto 300 °C
-Embedded microcontrollers
-Firmware and driver software
Test and Characterization
Together with you, we develop and optimize test setups to determine the parameters of your circuits and components , even for small series and engineering runs:
-Development of test methods
-Modular test platforms
-Development of application-specific test equipment
-Load board development for test platforms in production test
-Development of probe cards for wafer test
We support you in creating and optimizing automatic test sequences to determine trustworthy and reproducible measurement data:
-Wafer test (max. 12” / 300 mm wafer)
-Device test
-Test temperature (-60 °C … 300 °C)
-PXI test systems
-Test programming (LabView, Python, C)
-Statistical measurement data evaluation
To predict the lifetime of your circuits and components, we work with you to develop an accelerated ageing setup and perform the necessary ageing tests:
-Development of setups for ageing
-Determination of stress conditions
-Evaluation of the ageing development
For the transfer of your developments into production, we organize qualification tests for components or packages together with you:
-Planning and execution of qualification tests according to JEDEC standard
-Device qualification (HTOL, LTOL, Latch-Up, ESD, etc.)
-Package qualification (HTSL, UHAST, TC, etc.)
-Development of a suitable test environment
Methodological support for IC designers, fabs, and IP vendors
We support IC designers with the following services:
-Provision and further development of software for computer-aided fault analysis, e.g. analysis of measurement data, parasitic impact analysis for on-chip EMC bug fixing, pre-layout symmetry analysis
-Provision and further development of software for automatic model generation, e.g. AI-based generation of mixed-signal energy consumption models, generation of model checks (operating condition check on block and system level)
-Setup and maintenance of FPGA and IC design environments, e.g.: Git-based regression environments, simulator-in-the-loop testing of signal processing units (linking simulator/FPGA prototype to Matlab, Octave, or Python algorithms)
-AI-based analysis of design data, e.g.: automatic reviews of IC and PCB layouts
Trainings and workshops
Our portfolio comprises:
-Framework for AI-based analysis of design and test data
-Framework for automated model generation and model checks
-Development environment for the integration of regression tests and test-driven design for hardware development
We employ the following tools:
-Machine Learning (Python, TensorFlow)
-Analog Flavor Waveform Reader
-Cadence design tools
-OpenSource simulators (Icarus Verilog, Verilator)
-Simulator interfaces (Python-based, cocoTB, …)
-Agile project and code management with Git
Laboratory Equipment
Wafer test:
-Wafer prober for up to 12” / 300 mm wafers
-Test temperature: -60 °C … 300 °C
-Feeding of optical signals
-Active Probes
Test systems:
-PXI based
-Various instruments for analog-mixed-signal test
-Combinable with wafer prober
-Test automation with LabView
Parameter measurement technology:
SMU – Source Measurement Unit (min. 0.5 µV / 0.1 fA)
Impedance analyzer (20 Hz – 120 MHz)
Oscilloscopes (up to 12 bit / 8 GHz / 80 GSa)
Optoelectronics:
-Optical power meter
-Monochromatic light source ( 200nm – 1100nm)
-Spectrometer
-Time Tagger (time resolution 5 ps)
-Optical bench (vibration damped)
-Laser sources (pulsed / modulated)
-Fluorescence microscope
RF technology:
-Network analyzers (9 kHz – 50 GHz)
-Noise measurement equipment
-Spectrum analyzers (up to 26 GHz)
-Signal generators (up to 6 GHz)
-RFID test system
Power electronics:
-Curve tracer 400 A (pulsed/30V)
-SMU up to 10 kV
-Artificial Mains Network
ESD test:
-Voltage (up to 2.1 kV)
-Current (up to 40 A)
-ESD models HBM, TLP, MM
Environmental simulation:
-Heating chamber (up to 350 °C)
-Climate chamber (-40 °C … 150 °C / 0 % … 100 % RH)
MEMS measurement technology:
-Vibrometer
-White-light interferometer
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