Majelac Technologies

Majelac Technologies provides Semiconductor Assembly and Packaging services. We specialize in QUICK turnaround IC packaging. (Same Day Service is available)

We offer

• Wafer Dicing (up to 300mm), MPW wafers, Individual Die Dicing
• Epoxy Die Attach, Eutectic Die Attach, and Solder Die Attach
• Gold Ball Wire Bonding
• Aluminum Wedge Bonding
• Copper Wire Bonding
• Gold Ribbon Bonding
• Stud Bumping
• Heavy Wire Bonding (4 mil to 20 mil wire)
• Flip Chip Attach (Solder, Thermo Sonic, Thermo Compression)
• Encapsulation and Over molding
• BGA Ball Attach
• BGA Reballing
• MEMS packaging

Our Package capabilities include QFN, SOIC, QFP, Open Cavity packages, CPGA, PPGA, Sidebraze Dip, BGA, FCBGA, MAP type QFN, Chip on Board COB, and custom packages.