With an expertise in thermal solutions, Malico Inc, has been delivering thermal solutions to customers in various industries around the world since 1983.   Headquarter and manufacturing are located in Taiwan but we have technical/sales support through the U.S.


Our products are used in Semiconductors, Medical, Laser cutting equipment cooling system cold plate, Chipset testing cooling block, and IC package heat sink and heat spreader.   After years of hard work, our R&D team has successfully developed Tungsten Copper (W-Cu) heat dissipation materials with high thermal conductivity and low coefficient of thermal expansion (CTE). The materials can be easily formed by our forging or MIM processes without adding other metal materials and the results are near net shape.  It is definitely the most potential heat dissipation packaging material/process of the next generation.


We provide support from engineering sample productions to small and high volume productions.