MuAnalysis

Canada

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MuAnalysis is a privately owned professional laboratory specializing in materials characterization, failure analysis, and reliability testing of semiconductor, electronic, and photonic products. We go beyond silicon, with expertise in MEMS, compound semiconductor devices, lasers, LEDs, and batteries.

 

MuAnalysis serves customers worldwide across a wide range of industries, including electronics manufacturing, materials processing, defense and aerospace, medical instrumentation, and photonics. The firm provides advanced expertise in electron microscopy, optical microscopy, acoustic microscopy, X-ray analysis, materials characterization, failure analysis, and reliability testing. Our services include cross-sectioning and delayering, optical and electron microscopy, EDX mapping, counterfeit detection, photothermal microscopy, and visible and infrared laser microscopy, including OBIC and emission microscopy.

 

We also offer ESD and latch-up testing, as well as a broad range of JEDEC qualification and reliability tests. In addition, we test LEDs in accordance with IES LM-79 and LM-80 standards and provide reverse engineering services.

Services

Failure Analysis of ICs, CCAs, LEDs, Discrete Passive and Active Components

  • Optical inspection
  • X-ray radiography
  • Scanning acoustic microscopy
  • Decapsulation and package opening
  • Precision cross sectioning, delayering, staining, and chemical techniques
  • Plasma etching
  • Automated latch-up and curve trace testing
  • Precision mechanical electrical probing
  • Microthermal imaging
  • Liquid crystal fault isolation
  • Emission microscopy (EMMI)
  • Optical Beam Induced Current (OBIC) analysis
  • Infra-red (IR) optical microscopy
  • High-resolution optical and electron microscopy
  • Back-side (IR) imaging

Materials Analysis

  • Scanning electron microcopy
  • Elemental chemical analysis by EDX and XRF
  • FTIR micro-spectroscopy
  • Confocal Laser Scanning Microscopy (CLSM)
  • UV fluorescence imaging
  • Microcontamination analysis
  • Vickers Micro-hardness
  • O.S.E Test for ionic contamination

Counterfeit Detection and Materials Verification

  • Authenticity verification of electronic components per AS5553 and IDEA1010
  • Disjointment and RoHS screening
  • Conflict minerals screening
  • Construction analysis – package, structures and process definition
  • Yield and process defect analysis
  • Solder joint integrity analysis
  • Assembly inspection per IPC-A-610
  • Board construction per IPC-A-600
  • DPA per MIL-STD-1580

Reliability Testing per JEDEC JESD47, MIL-STD-883 or 750, Telcordia GR468, IPC, AEC etc...

  • Electrostatic Discharge (HBM, MM, SDM)
  • Latch-up
  • Temperature humidity bias (THB)
  • Highly Accelerated Stress Test (HAST)
  • Autoclave
  • High/low temperature storage (HDS, LDS)
  • Burn-in/Life test, static or dynamic
  • Power Cycling
  • Solderability
  • Preconditioning
  • Thermal cycling and thermal shock
  • Wire bond pull, lid pull
  • Die shear
  • Peel and Pull tests
  • O.S.E. cleanliness test for PCBAs

LED and Luminaire Analysis

  • Reliability testing per IES LM-79 and IES LM-80
  • Lumen measurements • CRI, CCT
  • Vendor identification

Consulting Services

  • Qualification program definition
  • Vendor/supplier assessments
  • Reliability/FA
  • Data analysis
  • Reliability monitoring
  • Fab support
  • Customized seminars/educational programs
  • Expert Witness services
  • Reverse engineering
  • Teardown reports
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