The Netherlands

Nedcard Logo

NedCard develops semiconductor package solutions and offers related assembly and test services for various devices used in smart card, RFID, IoT and other enabling technologies.


We build on broad experience and apply extensive technical capabilities to meet the industry’s highest requirements. Trustworthiness is what makes us unique; we provide maximum security and cost efficient manufacturing while meeting high quality standards. We have over 20 years of experience in offering package solutions for Banking & Payment, Telecom, eGovernment & Identification and Emerging markets. Our competence is your advantage.


Co-development in every stage of your project

We have the know-how, experience, infrastructure and relationships with the best suppliers in the industry to help you making your product development project successful. We are willing to offer utmost flexibility to tailor our support to your needs in every stage of your project.
For example, if you need more than one component assembled in the product, a capacitor or a second chip for extra memory, we can help design the lead frame to suit the special configuration and to assemble the components into the module. Solutions can be stacking up components or placing them side by side.

Package design & prototyping

We offer stand-alone package design and prototyping services. As a deliverable a proposal will be made on module design, bill of material and recommended processing conditions. Our design & prototyping offer:


  • Translate the intended application requirements into a package
  • Make a proposal for materials from leading suppliers in the industry
  • Use our broad base of partners for manufacturing the products when required
  • Design the module in a cost-efficient way for smooth production of large volumes
  • Make small-volume prototypes
  • Test and evaluate prototypes
  • Recommend further steps for industrialization


We can support you with the ramp up of your fully designed package by proposing and implementing improvements for successful industrialization. For an already industrialized product we can be your manufacturing partner offering production locations in either Europe or Asia. Our support:


  • Make and execute a ramp-up plan
  • Improve product and process design for cost efficient, high output manufacturing
  • Production data analyses and reporting
  • Customized logistics systems
  • Production capacity allocation

Development track record

Using a customized lead frame, we have manufactured LED-modules with a very small footprint and form factor. The challenge was handling small dies requiring special techniques for the die attaching process.


We have joined a Small Footprint Tag project at a stage where design was sub-optimal. We have put the project on track again. We have assembled a very small die into the module and co-developed a customized encapsulation technique.


We have built a stacked die configuration of the dimensions of a standard smart card module. NedCard also has succeeded in making progress from prototyping to industrial production volumes in a very short time.