PacTech

Germany

PacTech Logo

PacTech-Packaging Technologies GmbH, established 1995 and a group member of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc., Silicon Valley, USA and PacTech ASIA Sdn., Bhd., Penang, Malaysia. Since Q3 2005 PacTech is able to support our equipment customers in Asia/Far East via an established service centre out of Bangkok, Thailand.

The wafer level packaging subcontractor services consist of wafer bumping with electroless Ni/Au or Ni/Pd Under Bump Metallization (UBM) for wafer level solder bumping for Flip Chip or WLCSP as well as Ni/Pd/Au for wire bonding. Additionally PacTech offers AOI, X-Ray inspection, BCB Repassivation, wafer-level redistribution, wafer thinning, laser backside marking, wafer dicing, chip singulation, tape & reel services.

 

Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.