PHIX Photonics Assembly

PHIX aims to become world leader in the supply of photonic integrated circuit (PIC) based components and modules in scalable production volumes. We offer assembly and packaging services for the four major technology platforms (InP, Si, LiN and SiN) and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules. PHIX provides a one-stop-shop from design to volume production of PIC modules.

Our services and processes include:

• Plug-and-play prototyping of PIC-enabled modules, optimized for production scale-up
• Contract manufacturing for your photonics assembly and packaging process(es)
• Optical fiber arrays available from stock
• PIC polishing
• Die bonding
• Active alignment
• Wire bonding