Pragmatic

Using thin-film transistor (TFT) technology in combination with conventional semiconductor processing, FlexICs offer the performance of a semiconductor, while maintaining the form-factor benefits of flexible electronics.

Ultra-thin (~30µm), with a minimum bending radius of 5mm, FlexICs are currently delivered on 200mm wafers. Our 0.6-micron NMOS process platform offers four metal layers, dedicated resistor layer and high-K dielectric MIM capacitors. FlexICs are particularly suited to applications where form factor and cost outweigh speed and performance criteria – or anywhere ‘tiny technology’ is needed.

FlexICs can be placed onto areas traditionally void of functional parts, such as flex connectors, allowing designers and manufacturers to reduce the system footprint and device thickness, along with the bill of materials.

From memory to connectivity or sensing functionalities, FlexICs can be used in conjunction with devices such as displays and sensors to create novel solutions for countless applications, particularly where simple state machines or small control logic is required.

Pragmatic’s FlexIC Foundry® service takes FlexICs from tape-out to delivery within weeks, enabling agile iterations, early end-user testing, and an accelerated time to market – at a fraction of the cost of silicon.

Our process design kit (PDK) is fully compatible with industry-standard electronic design automation (EDA) tools, such as Synopsys, Mentor and Cadence. It includes:

• Technology files, describing the design rules
• Layer mapping files
• Design-rule checking tools
• Parameterized cells to enable the creation of customized instances and increase productivity (within the EDA tools)
• Layout versus schematic (LVS) physical verification deck and parasitic extraction for stress parameter measurement and electrical rule checking
• Device models describing the electrical behaviour of all devices used in simulation

For product concept, our comprehensive IC design services can help you find clean, elegant solutions to meet your technical specifications.