Testing
Our semiconductor testing facility is one of the largest in Europe, where we test digital, mixed signal, wafers and components.
We cooperate closely with our customers during the design stage to build cusomised test programs and ensure design for testability. Testing takes place in our class 6 clean room, which includes several automated testers, 8″ and 12″ wafer probers, pick and place component handlers, and gravity component handlers.
We have specific expertise in testing wireless communication components for both consumer and industrial applications. We test Bluetooth, WiFi, RFID, and other wireless frequency interfaces, including high-speed signals up to 40 GHz.
Or IC testing facility is ISO9001 and IS14001 certified.
Packaging
We offer a broad range of standard and innovative, top-quality packaging services to meet the diverse requirements of customers, such as electrical performance, heat dissipation, cost, and aggressive time-to-market.
Our packaging team can provide expert guidance for package characterisation and selection, assist with package design logistics and documentation, perform failure analysis to identify packaging-related yield issues, and drive post-packaging, final product qualification testing.