USA
QP Technologies (formerly Quik-Pak), a division of Promex Industries, is a leading provider of microelectronic packaging, assembly, wafer preparation, and substrate design and development services. At our state-of-the-art facility in Escondido, Calif., we leverage proven technologies to get your products to market quickly and in high volumes. We can provide virtually any package you need for prototype and commercial devices, including our Open-molded Plastic Packages (OmPP)® and Open-cavity Plastic Packages (OCPP), as well as ceramic and plastic IC packages. Through our substrate development business, we design turnkey, custom packaging solutions to meet your unique packaging requirements. Our IC assembly services range from wafer preparation (backgrinding, dicing, die sort and inspection) to flip chip die bonding, wire bonding, encapsulation, IC package marking/branding, and BGA sphere attach. Our advanced assembly services can accommodate chiplets, flip-chip, stacked die, SiP, MCM, CoB and other complex packaging structures.