Rochester Electronics

Rochester’s next-generation wafer storage capabilities include ISO-7/10K certified, nitrogen- controlled environment, secure room and individual cabinets, Stainless steel dry boxes incorporating microprocessor humidity control.

Our wafer processing capabilities include Back-side Grind (BSG), dicing, automated dice inspection, and sorting using state-of-the-art equipment in our Newburyport, MA facilities.

We provide a full range of including Quick Turn IC package assembly, Hermetic assembly, Plastic assembly, component lead finishing, package, substrate, and leadframe replication with a variety of lead finishes including Sn, SnPb, and RoHS.

Plastic Assembly:

• Wide range of package options including PDIPs, QFPs, QFNs, PLCCs, and BGAs.
• Wire Bond: gold and copper
• Commercial, military,
  and automotive flows
• Qualification services available

Hermetic Assembly:

• Die Attach: Eutectic,
  Silver Glass, and Epoxy
• Sealing: Frit, Solder Seal and Metal Can
• DLA, Space level, and Automotive-certified.
• Registered for ITAR

We provide a range of high-quality test services including Analog, Digital, Mixed Signal, Memory, and Power, with a range of legacy platforms through to advanced test solutions.

• Wafer die testing/finished goods testing
• Product burn-in
• Product up-screening and re-certification: military, industrial, and automotive

Rochester has significant expertise in which enables our customers to accelerate potential failure mechanisms, help identify root cause, and take actions to prevent failure mode.

• Materials analysis includes physical analysis, chemical analysis, materials characterization, contaminant identification, metallurgical analysis, and surface analysis.
• Utilizing techniques such as optical & SEM microscopy, EDS elemental analysis, X-ray, SAM, cross sectioning, package de-capsulation, die de-processing, build verification, DPA and construction analysis.
• We also provide IGA (Internal Gas Analysis) testing as a service

Rochester’s reliability lab is certified by the Defense Logistics Agency to provide Group A, B, C, and D testing to military standards, including space level. We also offer testing to commercial and automotive standards, such as JEDEC and AEC. All reliability testing can be performed as a service for Rochester manufactured devices or stock OCM devices. Our solderability test capabilities span all packages and standards, with both “dip and look” and “surface mount simulation” tests offered.

• Test to MIL microcircuit specification MIL- PRF-38535
• Test to MIL hybrid specification MIL- PRF-38534
• Test to commercial & automotive microcircuits specifications JESD47 & AEC-Q100
• Environment & mechanical
  device testing:
• Temp cycle / thermal shock,
  high temp storage
• HAST & HTOL
• Mechanical shock
• Constant acceleration
• Fine & gross leak testing
• Bond strength – bond pull /ball shear / die shear
• X-ray, solderability, lead integrity