TICP provides turnkey solution for Memory, Analog and mixed IC; packaging with lead-frame based includes quad flat package (QFP), small outline package (SOP),thin small outline package (TSOP) , quad flat no lead (QFN) and dual flat no lead (DFN). Substrate-based package, includes LGA,VLGA, BGA, Micro SD card and SD card. Furthermore, TICP is also capable of providing Chip Probing (CP) and Final Testing for . The goal of TICP is to provide its customer with world class IC turnkey services.
