Taiwan Technology Innovations
Taiwan
Taiwan Technology Innovations (TTI) offering IC packaging and assembly to worldwide customers , from engineering sample production, small volumes production to mass volumes production. We also provide various services such as wafer testing, reliability test and failure analysis, substrate design, turnkey solutions.
Services
Packaging Support List
We support the following packaging types:
- DIP Family – P-DIPs including skinny & shrink
- QFN Family – VQFN, VVQFN, UQFN, DR-QFN
- QFP Family – QFP, LQFP, TQFP with Exposed Pad options
- Transistor Outline Family- TO, SOT packages
- SOJ Family – SOJ, PLCC packages
- SOP Family – SOIC, QSOP, TSSOP, TSOP with Exposed Pad options
- LGA / BGA Family- LGA, TFBGA, UFBGA
- WLCSP
Tests Services
We provide the following test services:
- Wafer Test
- Final Test
- Reliability Test – Pre-conditioning, Thermal Cycling, High Temperature Storage and other tests etc…
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