Tekmos

Tekmos provides FPGA-to-ASIC Conversion and Replacement services to help organizations transition from programmable logic devices to cost-effective, high-performance custom silicon. While FPGAs offer flexibility during prototyping and early production, they often present limitations in unit cost, power consumption, and long-term availability. Tekmos enables a seamless migration to ASIC solutions that preserve functionality while delivering significant improvements in efficiency and scalability.

The process begins with a comprehensive analysis of the existing FPGA design, including logic utilization, timing constraints, interfaces, and system-level requirements. Tekmos’ engineering team then translates the design into an optimized ASIC architecture, refining logic, reducing redundancy, and tailoring the implementation for performance and manufacturability. This results in a solution that maintains the original behavior of the device.

Once validated, Tekmos manages the full manufacturing lifecycle, including fabrication, packaging, testing, and long-term supply. This turnkey approach minimizes risk and simplifies the transition for customers.

Tekmos provides a comprehensive Turnkey ASIC design and manufacturing service that enables customers to move from concept to production with a single, trusted partner. Our end-to-end approach streamlines the complex process of developing application-specific integrated circuits by integrating design, engineering, fabrication, assembly, testing, and long-term supply management.

The service begins with detailed design support, where Tekmos collaborates closely with the customer to understand performance, cost, and lifecycle requirements. Our engineering team handles everything from architecture definition and RTL design to verification and layout, ensuring that each ASIC is optimized for its intended application. In many cases, Tekmos utilizes a stacked die approach in the same package. This integrated workflow reduces any chance of development risk.

Once the design is finalized, Tekmos manages the entire manufacturing process, leveraging established foundry partnerships and proven supply chain strategies. We oversee wafer fabrication, packaging, and testing to ensure high reliability and consistent quality.

By combining technical expertise with full lifecycle management, Tekmos allows customers to focus on their core products while relying on a dependable partner to deliver custom ASIC solutions efficiently, reliably, and at scale.

Tekmos offers specialized Legacy Microprocessor Replacement services designed to help organizations extend the life of critical systems while overcoming obsolescence challenges. As original components become unavailable or unsupported, Tekmos provides a reliable path to recreate and modernize legacy microprocessors without requiring costly system redesigns.

Our process begins with a detailed analysis of the original device, including functionality, performance requirements, and system compatibility. Using advanced reverse engineering and design techniques, Tekmos develops form-fit-function replacements that replicate the behavior of the obsolete microprocessor while often improving reliability, manufacturability, and long-term availability. This ensures seamless integration into existing hardware with minimal disruption.

Tekmos then applies its turnkey ASIC design capabilities to implement the replacement in a modern, supportable semiconductor process. The new solution undergoes validation and testing to guarantee compatibility with legacy systems under real-world operating conditions.

By delivering dependable, drop-in replacements for obsolete microprocessors, Tekmos enables customers to preserve existing system investments while maintaining operational continuity and reducing overall lifecycle costs in industries like aerospace, defense, medical and industrial.

Tekmos provides Analog/Mixed-Signal ASIC Design and Manufacturing services that combine in-house digital expertise with trusted analog partnerships to deliver fully integrated, high-performance solutions. This collaborative approach allows customers to benefit from specialized design capabilities across both domains while working with a single, coordinated provider.

The process begins with system-level definition, where Tekmos works closely with customers to partition digital and analog functions for optimal performance, cost, and manufacturability. Tekmos leads the digital design portion, including architecture development, RTL design, verification, and physical implementation. In parallel, a vetted analog partner develops the custom analog components, such as signal conditioning, power management, or data conversion blocks, ensuring they meet precise electrical and performance requirements.

Tekmos then takes responsibility for integrating these elements into a unified mixed-signal ASIC. This includes managing interface compatibility, timing alignment, and layout considerations to ensure seamless interaction between analog and digital domains. The combined design undergoes comprehensive validation and testing to ensure robust operation across all intended conditions.

On the manufacturing side, Tekmos coordinates the full production flow, including foundry selection, fabrication, packaging, and test, delivering a complete turnkey solution.

Tekmos supports Defense, Medical, and High-Temperature Applications with specialized ASIC design and manufacturing services tailored to the stringent reliability, compliance, and environmental demands of mission-critical systems. These industries require components that perform flawlessly under extreme conditions, and Tekmos is equipped to deliver solutions that meet those expectations.

For defense and aerospace applications, Tekmos can execute MIL-STD design flows and qualification processes to ensure devices meet rigorous military requirements. This includes adherence to relevant standards for reliability, environmental stress, and long-term durability. In medical applications, Tekmos emphasizes precision, consistency, and traceability to support the high levels of quality and reliability required for healthcare systems.

Tekmos combines internal testing capabilities with a network of approved, industry-qualified vendors to perform comprehensive validation and qualification testing. This includes environmental stress screening, temperature cycling, burn-in, and other reliability assessments to ensure devices operate correctly in harsh or sensitive environments. For high-temperature applications, Tekmos designs and qualifies components capable of sustained operation under elevated thermal conditions, making them suitable for industrial and downhole energy use cases.

By managing both design and qualification within a controlled and trusted ecosystem, Tekmos reduces risk while ensuring compliance with industry standards. Our ability to coordinate complex testing requirements and maintain long-term supply makes us a dependable partner for customers operating in the most demanding application environments.

Tekmos provides Legacy Flash Memory Replacement services to address the growing challenge of obsolete or hard-to-source non-volatile memory components in long-life systems. As manufacturers discontinue older flash devices, organizations are often faced with redesign costs, supply chain uncertainty, or the risk of system downtime. Tekmos offers a dependable alternative by developing drop-in or functionally equivalent replacements that extend product lifecycles without requiring major hardware changes.

The process begins with a thorough evaluation of the original flash memory device, including its architecture, interface protocols, timing characteristics, and data integrity requirements. Tekmos’ engineering team then designs a compatible solution that preserves the behavior and performance of the legacy component while leveraging modern semiconductor technologies for improved reliability and manufacturability. This ensures seamless integration into existing systems with minimal validation effort from the customer.

Tekmos also addresses challenges such as firmware compatibility, endurance, and data retention to ensure the replacement meets or exceeds the original specifications. Each solution undergoes comprehensive testing to validate performance across operating conditions and to guarantee long-term stability.