Teledyne e2v Semiconductors

Through the breadth of capabilities that Teledyne e2v Semiconductors can draw upon, our team can attend to all aspects associated with the development and manufacturing of microelectronics solutions. The result is a trouble-free turnkey solution. As well as assembly, there is also scope for customized packaging designs to be implemented where necessary (so that limited available board space can be utilized more efficiently). After these stages have been completed, thermal and electrical simulation activities can be executed. Those are followed for comprehensive testing and finally qualification.

By dealing with everything via just a single source, rather than having to work with multiple partners, Teledyne e2v Semiconductors customers can avoid all the difficulties that will arise from having to manage suppliers for each different step of the process and the coordination of their respective activities.

Packages can be flip-chip or have wire bonded die arrangements. Which is most appropriate will depend on the available room on the board, the I/O density and the cost constraints involved. This is where Teledyne e2v Semiconductors is, once again, able to stand out – since low-volume flip-chip solutions are incredibly difficult to find. There are very few vendors that have such capabilities and even those that do will generally only be able to deal with small-sized devices. Through the flip-chip capabilities that we can leverage, the automated processing of 300mm diameter wafers is supported. Die sizes of up to 560mm2 can be attended to, with as many as 10,000 bumps being incorporated at bump pitches going up to 150µm.

The skills that Teledyne e2v Semiconductors’ team haves in relation to large die assemblies are of considerable value to those needing to embed FPGAs into their designs. In addition, our ability to offer very long dies sets us apart from the competition. These dies need to stay within extremely tight tolerances, as any bending could result in them being damaged – and this is where advanced assembly techniques are called for. Our high placement accuracy is another appealing attribute, providing customers with precision quality packaged solutions.

Once completed, there are many factors within the packaging that need to be examined, and this is why it is essential that the chosen supplier possesses all the necessary adeptness. Teledyne e2v Semiconductors’ one-stop-shop manufacturing service capabilities mean that after dies have been packaged, the resulting devices can be extensively tested and checked. On top of detailed characterization and scrutiny via visual inspection, we conduct comprehensive acoustic microscopy and geometric measurement work.

The mission-critical systems utilized in avionics, military and space applications need microelectronic devices that are capable of attaining exceptional reliability, so that the risk of potential malfunctions can be mitigated. Having a trusted source of such devices is therefore a fundamental requirement.

The small volumes and short development timeframes generally associated with these applications can present problems though. They mean that implementing a full custom design will usually be impractical. Selecting COTS devices may thus be necessary, and this enables the latest technological innovations plus a broader range of possible device options to be benefitted from too. However, such devices may not prove to be rugged enough. What is needed is access to a way of producing components which can combine the small-volume cost-effectiveness of COTS with added robustness characteristics.

We meet the quality benchmarks outlined by the AS9100 avionics standard, as well as the ESCC 9000, QML Class V, QML Class Y and QML Class Q space and military standards. In addition, we are in a position to assemble high-rel components that do not require ITAR certification. This means that the shipment restrictions that affect other suppliers when it comes to components for military systems do not apply.

Comprehensive screening processes can be undertaken to verify that the chosen COTS components will meet up to expectations. Different screening levels may be selected, depending how tough the actual application demands are. Screening programs can involve burn-in for a set number of hours at a defined temperature, repeated temperature cycling, exposure to intense thermal and mechanical shocks, plus radiation bombardment. Screening to ensure device optimization in relation to tight power budget constraints can also be offered. Our screening programs are constantly being updated and enhanced to keep on improving component output quality.

Teledyne e2v Semiconductors is a trusted SiP supplier with an unmatched reputation throughout the industry. We produce SiPs that are capable of fully addressing customers’ size, weight and power (SWaP) concerns – providing compact, performance-augmented, pre-qualified solutions that are packed with sophisticated functionality.

Our SiPs can incorporate numerous heterogeneous dies, based on different semiconductor technologies – with each being optimized for particular functions (such as RF transmission, signal conditioning, data processing, power delivery, data storage, image sensing and data conversion). These may include silicon-germanium (SiGe), gallium-arsenide (GaAs), gallium-nitride (GaN) and conventional silicon (Si).