Tessolve Semiconductor

With increasing design complexity, Pre-silicon Verification continues to consume the largest engineering effort in silicon and has the biggest impact on the key business drivers of quality, schedule and cost. Tessolve brings verification expertise across multiple industry verticals spanning Consumer Electronics, Industrial, Wireless, Data Centre/Enterprise, Automotive and Storage segments.

Tessolve verification offerings cover all aspects of the Verification flow from feature extraction to coverage closure and is equipped with custom-designed verification productivity tools for reducing verification turnaround times.

Highlights

• Comprehensive IP and SoC-level verification using C/C++, SystemVerilog, and UVM
• Processor-based verification expertise: ARM, RISC-V, Tensilica, x86
• Robust verification planning to achieve functional and code coverage goals
• Power-aware verification with UPF-based RTL and gate-level simulations
• Gate-level regression management and verification closure strategies
• Advanced productivity tools: Formal Verification, Portable Stimulus (PSS)
• Proprietary solutions: asureVERIF suite (asureVIP, asureSIGN) for productivity and compliance

Key Expertise:

• IP Verification
• SOC Verification
• CPU/GPU Verification
• DFX Validation
• Mixed signal verification
• Display and Video
  Sub-system Verification
• Low-power RTL and
  Netlist verification
• Gate Level Simulations

Physical design is a process in VLSI engineering in which the structural netlist is transferred from the front-end design to the back-end design team to transform into a physical layout database containing geometrical design information for every physical layer and is used for interconnections. Tessolve’s physical implementation services include:

Highlights

• Executed multiple mixed-signal SoCs from spec to silicon, in parallel execution models
• Specialized expertise in complex IPs and subsystems for Graphics, Processors, PCIe Gen5, CXL 3.0, GDDR6, LPDDR4, and Automotive domains
• Achieved timing closure for high-frequency designs up to 3GHz and technology nodes down to 3nm
• Proven capability in low-power specification development and implementation
• Development of timing, sign-off specifications, and comprehensive physical design checklists

Our Design for Testability experts team can help with the chip DFT architecture and implementation to increase IC test coverage, yields, and quality. Coupled with our large ATE test team and infrastructure, we are uniquely placed to build a coherent strategy and implement DFT that improves the testability of the IC in the post-silicon phase for first-pass silicon. Tessolve’s DFT service offerings include the following:

Highlights

• DFT architecture and scan methodology
• RTL-level DFT quality checks
• Scan insertion, ATPG pattern generation, and verification
• Memory BIST and Boundary Scan
• Fault Coverage Analysis, Debug, and Improvement
• Post-silicon debug support

The Analog and Mixed-signal design team at Tessolve specializes in high-quality custom chip design for applications with process nodes varying from 350 nm to most advanced 3nm designs. The IPs were developed for various industry verticals like Automotive, Communication, Consumer, Medical, IoT, etc. The competent team has rich experience in delivering chip solutions of more than 70+ silicon-proven Analog chips during the last few years with full ownership of the delivery from Spec to GDSII signoff, supported with silicon validation to global semiconductor companies.

Highlights

• Complete Analog Design life cycle from specs to post-silicon validation.
• Expertise in developing Full IP & Block level
• Offers in CMOS/FinFET process nodes: 3nm, 5nm, 7nm, 10nm, 14nm, 22nm, 45nm, 65nm, 90nm, 130nm, 180nm & 350nm

Tessolve provides end-to-end embedded product design services under an ODM model, covering the complete journey from concept to manufacturing. With proven expertise in domains such as Avionics & Rails, Automotive, Semiconductors and Industrial & Robotics, we enable customers to accelerate product development and achieve faster time-to-market.

Our offerings span the full lifecycle, including system design, hardware and mechanical engineering, BSP and firmware development, middleware and third-party application integration, application development, validation and testing, production management, and product lifecycle support.

Product Engineering Services Overview:

• Semiconductor Engineering – Expertise across chipsets and embedded platforms
• Wireless Testing – Validation for connected and IoT-enabled products
• Turnkey Development – Complete ODM-based product realization
• MAGIK2 Modules Portfolio – Scalable, production-ready embedded solutions
• IoT Solutions – Edge-to-cloud integration and deployment
• System Integration – Seamless hardware, software, and application convergence
• Chipset & Product Technical Support – Sustaining engineering and lifecycle services