Tessolve Semiconductor

Hardware Verification is the process of checking the design functionality for the given specifications. It is one of the largest tasks in silicon development and has the biggest impact on the key business drivers of quality, schedule, and cost. Tessolve offering covers all aspects of Verification flow from feature extraction to coverage closure and equipped with custom-designed verification productivity tools for reducing verification turnaround times. Tessolve bring verification expertise across multiple industry verticals spanning Consumer Electronics, Wireless, Data Centre, Automotive and Memory/Storage segments.

Highlights:

• Flexible resources proficient in verification methodologies and tools.
• Tools for verification productivity
• Consultancy programs and continuous improvements through Benchmarking.
• Training on verification strategy and the latest verification methodologies.

Key expertise areas

• Languages and Methodologies: C/C++/SystemVerilog/Verilog/SystemC/UVM
• Protocol Knowledge: High-speed, ARM-based, Memory, Storage, Serial IO, MIPI
• Processor Expertise: ARM, MIPS, x86, Power
• Low Power Verification – UPF Power-aware RTL and Gate Simulation
• Formal/Static Property based Verification
• Emulation Platforms – Zebu, Palladium, Veloce

Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs.

Expertise with all Industry standard EDA tools and Design Flows.  Well positioned to handle low power, high performance & area critical designs.

Highlights:

• RTL – GDSII (full chip and block level)
• Mixed signal designs
• Low Power designs
• High Performance designs
• Experience in most advanced Process nodes down to 5nm.
• Mobile, Server,  Graphics, Automobile SOCs etc.
• Flow / Methodology development.
• Expertise in all industry standard EDA tools – Synopsys, Mentor, Cadence, Ansys etc.

Tessolve has extensive experience in all aspects of DFx – DFT, Design for debug, Design for Manufacturability to name a few. Our team can help you in productizing your low cost IoT devices to complex 5nm designs. Our team has experience in talking your RTL and architect DFT, choose the right Test methodology, pick the appropriate test platforms for production. We have provided solutions to microprocessor based SOC, modem chips, Mixed signal, RF, mmWave chips as well as AI based IoTs. Our team has experience in all high speed I/O like DDR3, DDR4, PCI, USB etc.  We have successful tape-outs to volume production from 130nm to 7nm designs. Our extensive post silicon expertise has helped customers solve most challenging silicon debug and yield issues to achieve industrial, commercial to Automotive quality standards and meet time to market pressures.

The Highlights:

• Multimillion gate designs, with multiple clocks, multi power and voltage domains
• Mixed signal, RF and mmWave design DFT experience.
• DFT for low power designs.
• Embedded processor-based designs
• MBIST for all memory types – SRAM, ROM, CAM etc. Memory redundancy and repair to optimize yield.
• Complex Analog testing includes SERDES, DDR and A/D, D/A converters
• Experience in industry standard EDA tools for from Mentor Graphics, Synopsys and Cadence.
• Architecting Scan compression, at speed scan clock control, implement hierarchical DFT, incorporate third party IP blocks, verify the chip DFx.
• Provide Fault coverage or defect coverage enhancements, high pattern count reductions techniques using Test point insertions, provide LBIST insertion or in system test control insertion.
• Architect DFT incorporating test platform selection as well as test engineering flow to achieve cost, time to market and DPM targets.

Our teams close association with internal Test Engineering, Product engineering, Bench characterization as well as embedded systems teams provides valuable expertise in post silicon production to have the best time to market at best cost for our customers.

Analog and Mixed signal design team at Tessolve specializes in High quality design for different applications with process nodes varying from 350nm to most advanced 5nm designs. The IPs were developed for different industry verticals like Automotive, Communication, Consumer, Medical, IoT etc. The competent team has rich experience of successfully delivering more than 50+ silicon proven Analog chips during last few years with full ownership of the delivery from Spec to GDSII sign off, supported with silicon validation to global semiconductor companies.

The Highlights:

• Complete Analog Design life-cycle from specs to post-silicon validation
• Expertise for developing Full IP & Block level
• Expertise on CMOS/FinFET process node: 5nm, 7nm, 10nm, 14nm, 22nm, 45nm, 65nm, 90nm, 130nm, 180nm & 350nm
• High Speed AMS Design & Layout
• RF Layout
• IO Design & Layout
• Standard Cell Design & Layout
• Verilog-A & V-AMS Modelling

Tessolve prides itself on being first in class for test development. Whatever the device, whatever the platform we are confident that we can deliver an optimized test program. Our breadth and depth of experience allow us to decrease development cycle time by up to 30%! Moreover, Tessolve offers multiple platforms and testing equipment on its test floor, always manned by a team of experts provides 24/7 maintenance and operator support.

Our Test Engineering expertise includes:

• Test Plans and Strategy
• Test Program Development
• Bench to ATE Correlation
• H/W Design & Development
• Program Release @ OSAT
• Platform Conversions
• Production Analytics, Yield Monitoring, Optimization
• Device Expertise

ATE Exposure:

• Advantest V93000 SoC, T6575/T6373/T6752/T2000
• Teradyne: Catalyst, Eagle – ETS-364, ETS-88, ETS-800
• J750/MicroFlex/UltraFlex/I Flex/Tiger
• National Instruments: NI STS, STS-Tx
• Focused Test FTI 1000: Power Discrete
• TESSPOD: 28XX series

Tessolve offers end-to-end product design services in the embedded domain from concept-to-manufacturing under an ODM model with experience in multimedia products in Avionics, Automotive, Industrial and Medical. Tessolve’s solution includes system design, Hardware, and mechanical development, BSP and firmware development, Middleware integration, third party application integration, application development, testing and validation, production management and product cycle support.

Product Engineering Services Overview:

• Semiconductor Engineering
• Wireless Testing
• Turnkey Development
• MAGIK2 Modules Portfolio
• IoT Solutions
• System Integration
• Chipset/ Product Technical Support