XQWave

XQWave’s Front-End Engineering Team delivers robust, scalable RTL and SoC design solutions across a wide range of semiconductor applications. Our engineers bring deep expertise in RTL design and development, working closely with global architecture teams to define system and SoC architectures across multiple technology domains.

We have successfully developed complete RTL for complex IP blocks and full SoC integrations, ensuring designs are optimized for performance, power, and scalability. Our Front-End team collaborates seamlessly with Physical Design teams to achieve timing and power closure, and with Verification teams to drive comprehensive test planning, coverage definition, and coverage closure.

XQWave’s Front-End engineering services address critical design and verification challenges for advanced microchips used in automotive, networking, communications, AI, high-performance computing (HPC), IoT, and wireless infrastructure applications. With a strong focus on quality and first-pass success, we apply proven methodologies and industry best practices to deliver predictable outcomes.

Our Front-End capabilities include:

• System architecture and micro-architecture specifications
• RTL development and functional verification
• SoC and sub-system integration
• SystemC modeling and performance analysis
• Synthesis, lint, timing constraints, CDC, and low-power design
• Quality Checks: CDC, RDC, Lint

By combining technical depth with disciplined execution, XQWave helps customers accelerate development cycles and bring reliable silicon to market with confidence.

XQWave’s Design Verification (DV) Team delivers comprehensive, turnkey verification services to ensure first-pass silicon success for complex digital designs. Our engineers support the complete verification lifecycle, from architecture definition and test planning to execution, coverage closure, and sign-off.

We develop robust, reusable verification environments, including advanced test benches, BFMs, VIPs, scoreboards, and coverage models. Leveraging structured, coverage-driven methodologies, we ensure verification completeness, measurable quality, and predictable schedules. Our proven verification processes are designed to uncover corner-case bugs early, significantly reducing downstream risk and rework.

The DV team works closely with design, architecture, and physical implementation teams to align verification goals with real silicon behavior. We bring strong domain expertise across processor-based systems and high-speed interfaces, enabling efficient verification of both IPs and full SoC designs across multiple application domains.

Our Design Verification capabilities include:

• Architecting complex test benches using UVM, with experience in OVM and VMM
• System-level and scenario-based test case development
• Coverage-driven test planning, scheduling, and execution
• Verification from test plan creation through functional and code coverage closure
• Expertise in RISC-V and CPU-based designs, with working knowledge of PCIe Gen4/5, Ethernet, USB 3.0/OTG, SATA, AMBA, SPI, UART, and DDR4/5
• Scoping, estimation, and planning of large, complex verification projects

XQWave’s verification expertise helps customers deliver reliable, high-quality silicon with confidence.

XQWave’s Physical Design and Implementation Team delivers end-to-end, turnkey silicon implementation services using proven flows, mature methodologies, and deep domain expertise. Our teams operate in both ownership and turnkey engagement models and have successfully supported multiple production tape-outs across a wide range of process technologies.

Our leadership and engineering teams bring extensive hands-on experience across die sizes ranging from 30 mm² to 600 mm², consistently achieving optimal power, performance, and area (PPA) targets. We have worked with leading global foundries including TSMC, Samsung, GlobalFoundries, UMC, Tower, and SMIC, covering technology nodes from 180 nm down to advanced 3 nm processes.

We support the complete physical implementation lifecycle—from RTL synthesis and static timing analysis (STA) through place-and-route, physical verification, EMIR signoff, and final timing closure. Our teams collaborate closely with front-end and verification engineers to ensure design intent is preserved through silicon sign-off.

Our Physical Design expertise includes:

• RTL synthesis, constraints development, and timing analysis
• Floorplanning, placement, and congestion optimization
• I/O ring planning, bump planning, and RDL routing
• Clock tree synthesis (CTS), routing, and full-chip timing closure
• Block-level and full-chip STA signoff
• Low-power implementation and CLP checks
• Power integrity analysis (IR drop, EM, signal EM)
• Physical verification signoff (DRC, LVS, antenna)
• EMIR and ESD checks using Pathfinder or PERC
• Formal equivalence checking (LEC)
• Signoff checklists, QC, and tape-out readiness reviews

XQWave enables customers to tape out with confidence, quality, and predictable outcomes.

XQWave’s Design-for-Test (DFT) Team helps customers build robust testability into their ASIC designs from the earliest stages, enabling high-quality silicon and reliable production ramp. With increasing complexity, mission-critical applications, and competitive time-to-market pressures, integrating a comprehensive test strategy during design has become essential.

Our engineers define and implement end-to-end DFT architectures that deliver high fault coverage while minimizing impact on power, performance, and area. We work closely with design, physical implementation, packaging, and manufacturing teams to ensure seamless integration and production readiness.

XQWave supports the complete DFT lifecycle—from architecture definition and insertion through validation, silicon bring-up, and volume production support.

Our DFT capabilities include:

• Test architecture definition and implementation
• Scan and scan-compression insertion
• MBIST insertion at RTL and validation through simulation
• JTAG and boundary-scan (BSCAN) insertion, with close coordination with Physical Design and packaging teams
• RTL, gate-level, and post-layout simulation
• ATPG pattern generation, simulation, and diagnostics
• Test SDC constraint development and validation
• Silicon debug, bring-up support, and ATE testing
• Production support including HTOL, ESD qualification, and functional validation in the lab

XQWave’s DFT expertise enables faster yield ramp, reduced test costs, and dependable silicon across high-volume and mission-critical applications.

XQWave’s FPGA Design and Prototyping Services enable early validation and de-risking of complex ASIC and SoC designs through high-fidelity FPGA-based system implementations. We bring deep expertise in FPGA-based hardware, software, and firmware co-design, enabling customers to validate functionality, performance, and software stacks well ahead of silicon availability.

Our teams have successfully delivered ARM-based processor and power controller chip prototypes, including integration of ARM debug infrastructure, enabling realistic bring-up, system validation, and software development. We support a wide range of FPGA platforms and architectures, with strong experience in Xilinx (AMD) and Intel (Altera) FPGAs, including Zynq and ARM-based MPSoC platforms.

XQWave delivers complete FPGA solutions—from feasibility assessment and architecture definition to implementation, debugging, and system bring-up.

Our FPGA capabilities include:

• FPGA porting feasibility studies and architecture definition
• System and micro-architecture design
• RTL development and optimization in VHDL and Verilog
• Custom FPGA IP development and integration
• Hardware–software partitioning and co-design
• FPGA synthesis and implementation with area and timing optimization
• Timing closure across multi-clock designs
• Prototyping of ASIC sub-systems or full designs across one or more FPGAs
• FPGA-to-FPGA and ASIC-to-FPGA porting
• Industry-standard FPGA verification, testbench architecture, and coverage
• FPGA debugging using DMA-based data capture and Integrated Logic Analyzers (ILAs)
• System validation and silicon bring-up support

XQWave’s FPGA expertise accelerates development cycles while reducing risk and ensuring smoother transition to silicon.

XQWave’s Analog and Mixed-Signal Design Team delivers end-to-end analog solutions for complex ASIC and SoC designs across medical, industrial, consumer, and infrastructure applications. Our engineers bring deep expertise in full-chip development, leading designs from specification and architecture through layout, verification, and silicon tape-out.

We specialize in low-power, precision, and high-reliability analog circuits, working closely with digital, physical design, and system teams to achieve first-pass silicon success. Our capabilities span power management, data converters, clocking, RF telemetry, and mixed-signal interfaces, with extensive experience in ultra-low-power and mission-critical applications.

Core analog capabilities include PMICs (buck, boost, buck-boost, LDOs), voltage and current references, op-amps, filters, buffers, differential amplifiers, ADCs and DACs, oscillators, PLL/DLL, RTCs, and high-speed mixed-signal interfaces. We also deliver I/O design and layout, ESD-aware architectures, and layout-optimized analog blocks across a wide range of process nodes.

XQWave has delivered multiple full-chip and subsystem designs, including ultra-low-power identification devices, medical telemetry ASICs, hearing-aid chips, energy-metering solutions, precision power controllers, and mixed-signal communication interfaces. Our designs emphasize area, power, and performance optimization, supported by schematic-to-post-layout closure, silicon bring-up, and production readiness.

With proven leadership in complex analog projects and a strong focus on quality and predictability, XQWave enables customers to bring differentiated, reliable analog and mixed-signal silicon to market with confidence.