Looking for a BGA packaging company for prototype, low-volume or production semiconductor assembly?
AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering wire-bond BGA, flip-chip BGA, FCBGA, FBGA and custom substrate-based packaging services worldwide.
Submit your die, substrate, package, ball-count and production-volume requirements and AnySilicon can help identify relevant packaging partners for your ASIC, SoC, processor, sensor, RF, networking, automotive or other semiconductor project.
Need a BGA packaging quote?
Send your die size, pad or bump map, target package size, ball count, ball pitch, annual volume and assembly requirements. AnySilicon can help connect your project with relevant IC packaging companies.
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Ball Grid Array packaging is widely used when an IC needs more I/O connections, greater routing flexibility or higher electrical and thermal performance than many peripheral-lead packages can provide.
Depending on your project, a BGA packaging supplier may provide:
BGA is a broad package family. The optimum package depends on I/O count, die size, electrical performance, thermal requirements, package height, substrate complexity, reliability needs and production cost.
| Package Type | Typical Characteristics | Typical Applications |
|---|---|---|
| Wire-Bond BGA | Die connected to substrate bond fingers using wire bonds | ASICs, analog/mixed-signal ICs, controllers and moderate-I/O devices |
| Flip-Chip BGA / FCBGA | Die connected face-down through bumps or copper pillars | Processors, AI accelerators, networking ICs and high-performance SoCs |
| FBGA / Fine-Pitch BGA | Fine ball pitch and compact package footprint | Mobile, memory, consumer and compact SoC applications |
| PBGA | Organic laminate substrate with plastic encapsulation | General semiconductor and ASIC applications |
| CABGA | Chip-array style package with substrate routing and solder-ball array | Compact ASIC and mixed-signal designs |
| Lidless BGA | Package constructed without a conventional heat-spreader lid | Performance-sensitive or thermally optimized devices |
| Multi-Die BGA / SiP | Multiple dies or functional elements integrated into one package | Complex systems, RF modules, mixed-technology integration and SiP products |
One of the first package-architecture decisions is whether the die should connect to the substrate through wire bonds or through flip-chip bumps or copper pillars.
| Attribute | Wire-Bond BGA | Flip-Chip BGA |
|---|---|---|
| Die interconnect | Wire bonds | Bumps or copper pillars |
| I/O density | Moderate | Higher |
| Interconnect length | Longer | Shorter |
| Substrate complexity | Often lower | Often higher |
| Typical cost | Often lower | Often higher |
| Typical fit | Mainstream ASIC and mixed-signal designs | High-I/O and high-performance devices |
The correct choice should be based on the chip’s electrical, thermal, mechanical, I/O and cost requirements rather than package type alone.
The package substrate is a critical part of most BGA designs. It routes signals, power and ground between the silicon die and the external solder-ball array.
Important substrate-design parameters include:
For a deeper technical overview, see the
AnySilicon BGA Substrate Design Guide.
A typical BGA packaging project can include:
The more complete the package information, the easier it is for an assembly company to determine feasibility, substrate complexity, tooling requirements and pricing.
| Information | Example | Why It Matters |
|---|---|---|
| Package architecture | Wire-bond BGA or FCBGA | Defines assembly method and substrate complexity |
| Die size | 8.0 mm × 9.5 mm | Affects package body, substrate and thermal design |
| Pad / bump information | Pad ring or bump map | Required for substrate routing and assembly feasibility |
| Target package size | 17 mm × 17 mm | Constrains routing density and ball-map options |
| Ball count | 484 balls | Affects package size and substrate routing |
| Ball pitch | 0.8 mm | Influences PCB compatibility and package density |
| Power | 8 W maximum | Important for package thermal design |
| High-speed interfaces | PCIe, DDR, SerDes | May require controlled impedance and SI constraints |
| Annual volume | 500,000 units/year | Important for pricing, sourcing and capacity planning |
| Prototype quantity | 250 units | Determines engineering-lot feasibility |
| Qualification level | Commercial, industrial or automotive | Changes reliability and material requirements |
| Test scope | Assembly only or assembly + final test | Defines the required service scope |
Already have your BGA requirements?
Submit the package, substrate and volume information and let AnySilicon help identify suitable assembly and packaging partners.
BGA packaging cost depends on substantially more than the number of solder balls. Substrate complexity can be one of the most important cost drivers.
Important cost factors include:
For complex flip-chip designs, the substrate can require more layers, tighter routing rules and more advanced manufacturing than a simpler wire-bond BGA. These differences affect both NRE and recurring package cost.
For an early package-cost indication, use the
AnySilicon Packaging Cost Estimator
or the
IC Packages Price Calculator.
Semiconductor startups, MPW projects, universities, defense programs and specialty-product companies may need only a small initial quantity of packaged BGA devices.
Prototype projects may include:
The challenge is often finding a packaging supplier willing to support the engineering quantity while also providing a substrate and assembly flow that can scale into production.
When requesting a quote, provide both the prototype build quantity and the estimated annual production volume. This can help suppliers evaluate the complete commercial opportunity.
Production BGA programs require a packaging partner that can support not only the technical package design but also manufacturing capacity, quality, substrate sourcing and long-term supply.
For production programs, evaluate:
A BGA packaging supplier should be selected based on technical fit, substrate capability, production readiness and total project economics rather than unit price alone.
Questions to ask include:
Find a BGA Packaging Company
Provide as much information as possible:
BGA packaging is offered by OSAT companies, semiconductor assembly houses and specialty IC packaging providers. AnySilicon can help connect semiconductor projects with relevant packaging and assembly companies based on package type, technical requirements and production volume.
Typical inputs include die size, pad ring or bump map, target package dimensions, ball count, ball pitch, high-speed interface requirements, power dissipation, annual volume, prototype quantity, qualification requirements and final-test scope.
BGA cost depends on package architecture, substrate design, layer count, ball count, die size, wire-bond or flip-chip interconnect, thermal construction, production volume, qualification and test. Flip-chip BGA packages with complex substrates generally cost more than simpler wire-bond BGA packages.
Yes. Some specialty semiconductor packaging companies support prototype and engineering quantities. Feasibility depends on substrate availability, package complexity, die preparation and the assembly house’s minimum lot requirements.
Wire-bond BGA connects the die to the substrate with bond wires. Flip-chip BGA places the die face-down and connects it using bumps or copper pillars. Flip-chip BGA generally supports higher I/O density and shorter electrical paths but usually requires a more complex substrate and assembly process.
The BGA substrate may be designed by the OSAT, assembly house, substrate supplier or a specialized package-design company. The preferred approach depends on the package architecture, complexity, supplier flow and ownership model.
Many packaging providers can coordinate or provide final electrical test, but capability depends on the product, test platform, required temperature range, test time and production volume. Include test requirements in the initial RFQ.
