April-1, 2025 — United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced the official opening of its new 22nm wafer fabrication facility (fab) in Singapore’s Pasir Ris Wafer Fab Park. The grand opening ceremony was attended by high-ranking Singaporean officials, including Deputy Prime Minister Gan Kim Yong and Senior Minister Teo Chee Hean, underscoring the significance of this investment for Singapore’s advanced manufacturing sector.
This new facility represents a significant expansion of UMC’s global manufacturing capabilities. The first phase will boast a monthly production capacity of 30,000 wafers, commencing mass production in 2026. Upon full operation, UMC’s annual capacity in Singapore is projected to surpass 1 million wafers.
The fab will leverage UMC’s advanced 22nm and 28nm process technologies, currently the most sophisticated foundry technologies available in Singapore. These cutting-edge processes will support global customers across diverse applications, including smartphone displays, Internet of Things (IoT) memory, and next-generation connectivity solutions.
“This fab expansion marks a pivotal step forward for UMC,” stated UMC Co-President Chien Shan-chieh. “It aligns perfectly with the Singapore government’s vision to establish itself as a leading advanced manufacturing hub, and we are deeply appreciative of their ongoing support.”
This expansion is expected to generate approximately 700 new jobs in Singapore, encompassing roles for process engineers, equipment specialists, and R&D experts. UMC’s investment reinforces its commitment to technological innovation and its contribution to the global semiconductor ecosystem.
