Author Archives: anysilicon

Name: anysilicon

28nm vs 40nm vs 65nm — The Real Cost, Risk, and Power Trade-Off for ASICs

press release wafer

Choosing between 28nm, 40nm, and 65nm is one of the most common — and most underestimated — decisions in ASIC development.
 
These nodes dominate industrial, automotive, consumer, and IoT ASICs, yet teams often choose based on habit or outdated assumptions. In reality, the differences between 28nm, 40nm, and 65nm

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TSMC 22nm vs UMC 22nm vs GF 22FDX — Which Should You Choose?

press release wafer

Choosing a 22nm process node is not just a scaling decision — it is a strategic choice that affects power consumption, cost structure, ecosystem access, and long-term product risk.
 
For many ASIC and SoC teams, 22nm sits at the crossroads between mature nodes (28nm/40nm) and more advanced, higher-risk technologies.

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Exclusive Interview: Mika Jäsberg Discusses CoreHW’s RTLS Offering

In this exclusive interview, Mika Jäsberg, Head of Sourcing, Manufacturing, and Operations at CoreHW, shares insights into the company’s next-generation real-time location system (RTLS). He discusses CoreRTLS Tag series, CoreRTLS-LOC4000, and CoreRTLS software—highlighting innovations in accuracy, scalability, and security that position CoreHW as a leader in location intelligence technology.
 

 
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Find a Local Semiconductor/ASIC/IP Sales Representative (Asia, Europe, US)

Two funny scientists

AnySilicon helps you connect with experienced sales agents, reps, and local partners across Asia, Europe, and the US — at no cost.
 
Expanding into a new market is hard—especially in semiconductors. Cultural gaps, language barriers, and the challenge of finding trusted local representation often slow things down.
AnySilicon offers

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The Future of Semiconductors: A Deep Dive with Howard Pakosh

Howard Pakosh Interview

This interview features Howard Pakosh,  CEO & Founder at The TekStart Group.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
When I founded TekStart® back in 1998, the idea was simple but ambitious. Take

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Innovation Meets Customization: Unlocking breakthroughs in next-gen sensing 

Discover how ams OSRAM’s ASIC customization, in-silicon innovation, and advanced packaging deliver reliable, efficient and high-performance sensing solutions for industrial and medical applications. 
 
Customization to meet power, reliability, and integration needs in next-gen sensing 
Across the industrial and medical sectors, engineers and product leaders face the same persistent dilemma: how to deliver smarter, more

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