BELGIUM – October 21, 2025 – Sofics BV, a world leading solution provider specializing in physical layout and design, with a focus on the built-in robustness of integrated circuits that demand superior power, performance, and area (PPA), today announced the successful tape-out of a new test chip on TSMC N4C
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Santa Clara, California, RISC-V Summit — October 22, 2025 — Semiconductor intellectual property provider CAST today announced the CAST Catalyst™ Program, a new way for embedded system developers to adopt RISC-V processors faster and with less risk. Catalyst combines CAST’s proven 32-bit RISC-V processor IP cores with simplified configurations, flexible
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October 21, 2025 — Hsinchu, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced plans to break ground on its new 1.4 nanometer (A14) fabrication facility in Taichung, Taiwan, on November 5, 2025. The groundbreaking marks a major milestone in TSMC’s ongoing roadmap toward next-generation
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Woodcliff Lake, New Jersey — October 17, 2025 — Semiconductor intellectual property core provider CAST today announced that its Time-Sensitive Networking (TSN) IP technology has been selected by the Eckelmann Group for integration into advanced heavy ion beam therapy systems developed for the Heidelberg Ion Beam Therapy Center (HIT), a
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Oct. 06, 2025 – Kaiserslautern, Germany — Creonic GmbH, a leading provider of ready-for-use IP cores for communication systems, announces the update of its Doppler Channel emulation IP core. The update introduces significant enhancements that increase flexibility and precision in satellite communication simulations.
The model now supports a wide range of satellite frequency
TEMPE, Ariz.–(BUSINESS WIRE)–Oct. 6, 2025– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.
The expanded investment includes additional cleanroom space