Author Archives: anysilicon

Name: anysilicon

Maximizing SoC Longevity with PCIe 3.0: A Designer’s Guide

As PCIe 5.0 and 6.0 dominate headlines in the semiconductor industry, it’s tempting for every SoC design team to reach for the newest protocol available. But not every application needs blazing-fast 32GT/s throughput—and not every market segment can afford the power, complexity, and cost penalties that come with bleeding-edge PHYs.
Read More

Three Ethernet Design Challenges in Industrial Automation

Conveyor for the production of television sets.

As factories, process plants, and robotics platforms become increasingly intelligent and interconnected, the demand for stable, low-latency data links has pushed Ethernet deeper into embedded systems. However, since designing Ethernet connectivity into industrial chips comes with its technical and logistical hurdles, engineers may face challenges when implementing Ethernet in industrial

Read More

Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions

press release

BELGIUM – October 21, 2025 – Sofics BV, a world leading solution provider specializing in physical layout and design, with a focus on the built-in robustness of integrated circuits that demand superior power, performance, and area (PPA), today announced the successful tape-out of a new test chip on TSMC N4C

Read More

CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program

news

Santa Clara, California, RISC-V Summit — October 22, 2025 — Semiconductor intellectual property provider CAST today announced the CAST Catalyst™ Program, a new way for embedded system developers to adopt RISC-V processors faster and with less risk. Catalyst combines CAST’s proven 32-bit RISC-V processor IP cores with simplified configurations, flexible

Read More

TSMC to Break Ground on 1.4nm “A14” Fab on November 5

TSMC building

October 21, 2025 — Hsinchu, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced plans to break ground on its new 1.4 nanometer (A14) fabrication facility in Taichung, Taiwan, on November 5, 2025. The groundbreaking marks a major milestone in TSMC’s ongoing roadmap toward next-generation

Read More

TSN Technology from CAST Powers Advanced Cancer Treatment

press release

Woodcliff Lake, New Jersey — October 17, 2025 — Semiconductor intellectual property core provider CAST  today announced that its Time-Sensitive Networking (TSN) IP technology has been selected by the Eckelmann Group for integration into advanced heavy ion beam therapy systems developed for the Heidelberg Ion Beam Therapy Center (HIT), a

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.