Author Archives: anysilicon

2.5D vs 3D Packaging: What Is the Difference?

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font-family: Arial, Helvetica, sans-serif;
color:#222;
line-height:1.72;
margin:0;
background:#fff;
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article {
max-width:980px;
margin:0 auto;
padding:0 18px 42px;
}
h1 {
font-size:38px;
line-height:1.18;
margin:0 0 22px;
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VQFN Package: What It Is, Sizes, Price & PCB Design

body{
font-family:Arial,Helvetica,sans-serif;
color:#222;
line-height:1.72;
margin:0;
background:#fff;
}
article{
max-width:980px;
margin:0 auto;
padding:0 18px 42px;
}
h1{
font-size:38px;
line-height:1.18;
margin:0 0 22px 0;
}
h2{
font-size:29px;
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QFN vs QFP: What Is the Difference and Which Package Should You Choose?

body{
font-family:Arial,Helvetica,sans-serif;
color:#222;
line-height:1.72;
margin:0;
background:#fff;
}
article{
max-width:980px;
margin:0 auto;
padding:0 18px 42px;
}
h1{
font-size:38px;
line-height:1.18;
margin:0 0 22px 0;
}
h2{
font-size:29px;
Read More

BGA Packaging Services – Find BGA Assembly Companies

Looking for a BGA packaging company for prototype, low-volume or production semiconductor assembly?
 

AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering wire-bond BGA, flip-chip BGA, FCBGA, FBGA and custom substrate-based packaging services worldwide.
 
Submit your die, substrate, package, ball-count and production-volume requirements and

QFN Packaging Services – Find a QFN Assembly Company

Looking for a QFN packaging company for prototype, low-volume or production assembly?
 
AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering standard and custom QFN packaging services worldwide.
 
Submit your die, package and volume requirements and AnySilicon can help identify suitable packaging partners for

Hire ASIC Verification Engineers

Finding experienced ASIC verification engineers can be difficult when your chip project requires strong UVM, SystemVerilog, coverage, formal verification, protocol knowledge or complex SoC-level debug.
 

AnySilicon helps semiconductor companies, startups and engineering teams connect with ASIC verification engineers, UVM specialists, SoC verification experts, formal verification engineers, contractors and