LEUVEN (Belgium), JUNE 11, 2025— This week at the 2025 Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and IDLab, an imec research group at Ghent University and the University of Antwerp, Belgium, announced a significant breakthrough in high-speed digital-to-analog conversion.
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM、ReRAM) technology with a rich IP ecosystem and development-ready support, providing a
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Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) today announced that its ultra-low energy and high-performance Neural Network Processing Unit (NPU) IP now supports on-device inference of large language models (LLMs) with AI computing performance scaling beyond 40 TOPS. This energy-efficient NPU architecture is specifically designed to meet the increasing demand for
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June 9, 2025 —- TrendForce’s latest investigations find that the global foundry industry recorded 1Q25 revenue of US$36.4 billion—a 5.4% QoQ decline. The downturn was softened by last-minute rush orders from clients ahead of the U.S. reciprocal tariff exemption deadline, as well as continued momentum from China’s 2024 consumer subsidy program.
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Sheffield, UK – 10 June 2025. SureCore, the leading ultra-low-power memory specialist, has launched a comprehensive suite of silicon services, to help customers developing cutting-edge applications address complex design requirements. Leveraging its extensive experience in low-power and low-voltage design, the sureCore team can provide expert engineering support across every facet of SoC
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MALTA, N.Y., June 4, 2025 – GlobalFoundries (Nasdaq: GFS) (GF), working with the Trump Administration and with support from leading technology companies aiming to onshore critical components of their supply chain, today announced plans to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities across its facilities
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