Imagine that you and your friends are ASIC engineers and you come up with a revolutionary idea for a semiconductor chip which could potentially change our life. You finally agree to start a company and start the ASIC development. But how will you manufacture the silicon wafers? do you need
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IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published in January 2019. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified
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Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including
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Moortec, provider of complete In-Chip Monitoring PVT Subsystems announced today that Credo has utilised Moortec’s Temperature Sensor and Voltage Monitor IP to optimise performace and increase reliability in their latest generation of SerDes chips.
Credo offers high-performance, mixed-signal semiconductor solutions including advanced serializer-deserializer (SerDes) IP and interconnect
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The Multi-Protocol Video Interface IP solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and
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Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has been playing a vital role in the lifecycle of many products, for numerous companies worldwide, from early prototypes to mass production.
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