Author Archives: anysilicon

Name: anysilicon

Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory

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Dolphin Integration, leader in innovative design solutions for the next generation of Energy-Efficient System-on-Chips, augments TSMC’s IP ecosystem at 40 nm with TITAN, a breakthrough architecture for Read Only Memory compiler. This cost effective, single-layer and late programmable ROM compiler is capable of generating instance sizes from 512 bits to

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Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales

Codasip, the leading supplier of RISC-V® embedded processor intellectual property, today announced that Jerry Ardizzone has joined as Vice President of Worldwide Sales, reporting to CEO Karel Masařík.
 
“We are very excited to have Jerry on board to lead our global sales efforts,” declared Karel Masařík, CEO and founder

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CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators

Semiconductor intellectual property provider CAST, Inc. has taken advantage of a new cloud-based FPGA accelerator marketplace developed by Accelize®to make industry-leading GZIP data compression available to users and developers whenever they need it.
 
The new AccelStore™makes critical functions like GZIP directly available to end users on a rental by

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CEO Talk: Stefano Perticaroli, RAME

This interview was help with Stefano Perticaroli, Ph.D. Eng., CEO at Radio Analog Micro Electronics srl.
 

 
Tell me a bit about your background? How did you first get started with Radio Analog Micro Electronics?
 
I completed my Ph.D in Electronics Engineering at DIET Sapienza Università di Roma

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On-chip ESD protection for 40nm and 28nm CMOS technology

Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
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Imec and Cadence Tape Out Industry’s First 3nm Test Chip

Silicone wafers in a carrier

The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using

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