Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Cambricon have used Moortec’s 16FFC In-Chip Monitoring Subsystem IP in their artificial intelligence (AI) and machine learning chips.
“After a comprehensive investigation on almost all commercial solutions, we concluded that the PVT sensors from Moortec were the best
Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to
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Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest CABGA process has been extensively demonstrated, evaluated and optimized to provide reliable, high-quality production. By extending CABGA capabilities to various competing near die size
Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its upgradation to ISO 9001:2015 certification. By meeting the extensive criteria for the ISO 9001: 2015 standards, the company reinforces its ability to deliver IC design services with continuous improvements in its offerings and
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IC Insights has revised its outlook and analysis of the IC industry and presented its new findings in the Mid-Year Update to The McClean Report 2017, which originally was published in January 2017. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World
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Sales of memory ICs are expected to show the strongest growth rate among major integrated circuit market categories during the next five years, according to IC Insights’ new 2017 McClean Report, which becomes available this month. The 20th anniversary edition of The McClean Report forecasts that revenues for memory products—including DRAMs and NAND
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