Allwinner Technology, a Chinese fabless semiconductor company that design and manufacture SoC processors announced a new laptop that could cost $79. Since its founding in 2007, Allwinner has released more than 15 SoC processors that have been widely implemented in Android-based tablets, as well as in smartphones, laptops and more.
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High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology.
In June 2015, AMD introduced its Fiji
Later this month, IC Insights will release its new 2016 IC Market Drivers Report. The report contains analyses on automotive electronics, the Internet of Things, tablet PCs, smartphones, medical and health systems, and several other mature and emerging electronic systems.
The upcoming IC Market Drivers Report finds that from 2014 through 2019, the
Israeli start-up Glassify joined the IoT revolution and introduces the first beer glass integrating a semiconductor chip. The beer glass allows consumers to connect the glass to the smartphone using NFC technology.
According to the company the new beer glass allows consumer to enjoy a more personal
SK hynix, Inc., Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete high-bandwidth memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect an SoC and an HBM memory stack. Many companies are already using HBM to
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Samsung Electronics, the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first 10-nanometer (nm) class* , 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them. DDR4 is quickly becoming the most widely produced memory for personal computers and IT
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