With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look into the use copper wire. However, there are many drawbacks to using copper wire, including the short shelf
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UMC’s CEO, Po-Wen Yen, confirmed the drop of 5% on wafer shipment performance for the third quarter of 2015. The CEO justified this forecast by referring to a restricted market visibility and to weaknesses in the demand due to the uncertain economic environment. Not only, Po-Wen-Yen mentioned also the inventory
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ARM has acquired Israel-based Sansa Security, a provider of hardware security IP and software for advanced system-on-chip components deployed in Internet of Things (IoT) and mobile devices. The company currently enables security in more than 150 million products a year and Sansa Security technology is deployed across a range of
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I recently read an interesting article “Intel’s cost cuts could give rivals higher ground: analysts” where the analysis claims that Intel Corp’s move to delay the launch of its next generation chip technology to 2017 may see the company lose ground to rivals Taiwan Semiconductor Manufacturing Co and Samsung Electronics
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I authored my first book “Mass Capitalism : A Blueprint for Economic Revival” in 2014 with a purpose of letting the global semiconductor industry ( and particularly the US Semiconductor Industry) know that the Semiconductor Industry is headed for a monumental transformation in the very near future due to a
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With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital cameras and laptop computers—original equipment manufacturers (OEMs) and integrated device manufactures (IDMs) have joined forces to ensure enhanced chip performance without sacrificing valuable board real estate. Rather than use conventional single chip
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