The corner-based timing signoff approach is a historical and traditional method that has justified a development and enhancements of conventional STA tools and signoff flows. The number of signoff corners exponentially grows along with an increase of variation sources, their magnitude, and timing margins. It becomes a bottleneck in
Read MoreDuring the last decades, important advances in microelectronic techniques and technologies had been fueling the introduction of new wireless enabled products accessible to a large number of people around the world. Without the competitive price offered by CMOS, the widespread use of wireless enabled engineering complex devices, e.g. smartphones, tablets, etc. would certainly have been delayed.
Read MoreBob Colwell, Director of the Microsystems Technology Office (MTO) at the Defense Advanced Research Projects Agency (DARPA), recently made a compelling statement about the end of Moore’s Law: “When Moore’s Law ends, it will be economics that stops it, not physics. Follow the money.”
If we move beyond Moore’s
The corner-based timing signoff approach is a historical and traditional method that has justified a development and enhancements of conventional STA tools and signoff flows. The number of signoff corners exponentially grows along with an increase of variation sources, their magnitude, and timing margins. It becomes a bottleneck in the
Read MoreThere has been a substantial amount of discussion about the noise of power supplies and its harmful effect inside wireless electronic devices such as cell phones and WiFi or bluetooth enabled portable devices. Due to an increased pressure to extend battery life in portable devices, switching (or DC-DC) regulators have
Read MoreFor decades, electronics product innovation has been incremental in nature, relying largely on the next generation of semiconductors to deliver performance improvement. For almost 50 years Moore’s Law has delivered 2x performance (power or cost) improvement in semiconductors every 18 months, outpacing any product or system level innovation cycle that
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