Author Archives: anysilicon

Name: anysilicon

Introduction to Chip Scale Packaging

fan in wlcsp vs fan out wlcsp feature

Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how devices are designed and manufactured, impacting various industries.
 

 
Chip Scale Packaging is characterized by its compact size, which allows for

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Semiconductor Trends Shaping 2025

semiconductor trends 2025

The semiconductor industry stands at the forefront of innovation and change. From the smartphones in our pockets to the autonomous vehicles of the future, semiconductors are the critical building blocks that drive progress across various sectors. Understanding the trends shaping this industry is essential for grasping the future of technology.
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CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core

press release

Woodcliff Lake, New Jersey — January 16, 2025—CAST, a leading semiconductor intellectual property (IP) core provider, is excited to announce the upcoming release of its new KiviPQC™-KEM IP core and invites early adopters to engage in product evaluations. This new IP core implements the Module-Lattice Key Encapsulation Mechanism (ML-KEM) as

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SkyWater Announces ThermaView Solutions to Strengthen Domestic Support for High Performance Thermal Imaging

skywater thremaview

BLOOMINGTON, Minn. – January 15, 2025 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the launch of ThermaView℠ Solutions, a complete suite of services and technologies designed to meet the evolving needs of thermal imaging system designers. These solutions will deliver capabilities to support development and production of state-of-the-art,

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YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet

chiplet

SAN RAMON, CA, UNITED STATES, January 14, 2025 — YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low power devices exist in open market as Chiplets. Designers currently have to license the IP and integrate into a custom SOC while

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NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation

press release

January 13, 2025 — The National Aeronautics and Space Administration (NASA) awarded four contracts in 2024 to Alphacore to advance the development of cutting-edge microelectronics systems to support space and other missions. Alphacore, a leader in analog, mixed-signal, and RF integrated circuit design intellectual property, excels in creating high-performance, low-power designs

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