dear sirs, can you clarify the term “blind assembly”? what are pros & cons?
Hi,
“Blind Assembly” means assembly of dice without running wafer sort.
This is usually done for the first wafer of the product in order to get the engineering samples as soon as possible (or when wafer sort is not yet ready), or when you assume that your product will have a high yield, and the cost of wafer sort will be higher than the cost of packaging failed dice.
The forum ‘Forum’ is closed to new topics and replies.