Paris, France – May 19, 2025 – Foxconn Technology Group today unveiled a comprehensive €250 million investment plan in Europe, marking a strategic expansion into advanced semiconductor packaging, satellite manufacturing and electric vehicle production on the continent.
Key Highlights:
Joint Venture in Advanced Packaging: Foxconn will form a joint venture with Thales and Radiall to establish Europe’s first facility dedicated to fan-out wafer-level packaging (FOWLP) and outsourced semiconductor assembly and testing (OSAT). The new plant will leverage cutting-edge FOWLP technology to serve European customers in the automotive, aerospace, 6G communications and defense sectors, strengthening Foxconn’s local footprint and global supply chain resilience.
Strategic Satellite Partnership: In collaboration with Thales, Foxconn will co-develop high-value satellites for large-scale low Earth orbit (LEO) telecommunications constellations. Building on the successful launch of Foxconn’s in-house LEO PEARL CubeSat in November 2023, this partnership marries Thales’ space technology leadership with Foxconn’s manufacturing expertise to deliver industrialized contract‐manufacturing services across the satellite supply chain.
Ecosystem Collaborations: Foxconn and its subsidiaries have secured multiple partnerships to bolster its satellite ecosystem, including a LEO user terminal with FIH and Sharp, an Earth observation camera module with Rayprus, and space-grade connectors and cables with FIT.
Electric Vehicle Expansion: Foxconn’s automotive arm, Foxtron Vehicle Technologies, has signed a memorandum of understanding with Mitsubishi Motors Corporation. Under the MOU, Foxtron will oversee design and manufacturing management for a new electric vehicle slated to launch in Australia and New Zealand in the second half of 2026.
