Introduction to HTOL

HTOL (High Temperature Operating Life) is a stress test defined by JEDEC to define the reliability of IC products, and is an essential part of chip qualification tests. This post provides a high-level overview of HTOL. Obviously, you should refer to the standard if you plan to perform HTOL testing.


To predict reliability and operating life of IC products, JEDEC has defined a stress test that exposes the IC to extreme temperature conditions. Test results are then used to predict the long term failure rate of the IC. Almost every ASIC that is going to production must go thought HTOL testing.


An HTOL test is performed in an oven with 125C degrees, while the ICs are activated with dynamic signals and the VCC pins with max voltage. The details are specified in the following table.



JEDEC Standard JESD22-108, JESDS85
Temperature T>=125C
No. of Lots 3
No. Devices per Lot 77
Duration 1000 hours
Accept criteria 0 fails


After the HTOL stress test is completed the ICs must go through electrical screening to determine how many devices passed or failed the stress test. The JEDEC requirements define zero failures as an acceptable criterion, with test results defined in terms of FITs (failures in time). One FIT symbolizes one failure in 109 device hours.


To perform the HTOL test, all ICs must be in an oven, ideally placed in sockets and located on a PCB. Both sockets and burn-in-board must be able to withstand the high temperature during the test.


HTOL stress test


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