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Sr. FPGA Modem and Physical Layer Development Engineer, Amazon Leo

Published Date: March 22, 2026
Amazon Kuiper Manufacturing Enterprises LLC, Austin, TX
Job Description:

We are seeking a skilled FPGA Design Engineer to create high-performance FPGA solutions for next-generation modem systems from LEO satellites. This role involves defining and implementing a state-of-the-art wireless communication system focused on ultra-reliable low-latency and high-throughput physical layer (PHY) solutions. The engineer will collaborate with systems teams to develop and release FPGA-based signal processing and modem solutions using modern design methodologies.

Responsibilities:

  • Design and implement a wireless modem on an ARM/FPGA system-on-chip platform.
  • Develop RTL code through the full development lifecycle, including system architecture definition, RTL design, physical implementation, timing closure, and simulation validation.
  • Collaborate with Digital Communications and RF system architects to implement complex logic functions such as signal detection, synchronization, channel coding, beamforming, and massive MIMO processing.
  • Work with HW, FW, and SW teams to test integrated systems combining FPGA, RF front-ends, and networking stacks.
  • Conduct trade-off analysis to optimize FPGA resources for cost, size, power, and performance to meet stringent 5G latency and throughput requirements.
  • Perform lab-based silicon validation to ensure modem performance meets throughput and reliability metrics.

Qualifications:

  • Bachelor's degree or above in electrical engineering, computer engineering, or equivalent.
  • 7+ years of experience in FPGA design and implementation using System Verilog/Verilog/VHDL.
  • Experience with modern ASIC/FPGA design and verification tools.
  • Hands-on experience with Xilinx/AMD or Intel/Altera FPGAs.
  • Experience in RTL coding and debug, as well as performance, power, area analysis and trade-offs.

Skills:

  • Experience in embedded development in C/C++ or writing low-level drivers.
  • Familiarity with Physical Layer designs for wireless modems on ARM/FPGA SoCs.
  • Experience developing test venue software and hardware infrastructure for hardware-in-the-loop (HIL) testing environment.
  • Proven track record of successfully fielding and supporting complex FPGA or ASIC-based wireless products.

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