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MediaTek Races to 2nm: A New Era in Mobile and AI Chip Technology

May-20-2025 — MediaTek, the Taiwanese semiconductor giant, is poised to enter the cutting edge of chip technology with its upcoming 2nm chip, set to tape out in September 2025. The announcement, made by CEO Rick Tsai at Computex 2025, marks a significant milestone for the company and underscores its strategic partnership with TSMC, the world’s leading contract chip manufacturer.

 

This 2nm chip, manufactured using TSMC’s advanced process, represents a remarkable technological leap for MediaTek. Just over a decade ago, the company relied on 28nm technology for its MT6589 chip. This latest development showcases MediaTek’s aggressive upmarket strategy, a journey that has seen the company’s smartphone chip shipments skyrocket from 10 million in 2011 to an estimated 300 million in 2014.

 

The new 2nm chip’s exact application remains unclear, though reports suggest it could be either a next-generation flagship smartphone SoC or a custom ASIC designed for NVIDIA’s NVLink Fusion system. MediaTek’s deepening partnership with NVIDIA is a key factor here, with MediaTek leveraging its ASIC design expertise and high-speed interconnect capabilities to create custom AI silicon for cloud-scale AI workloads. This positions MediaTek alongside other leading companies like Marvell and Alchip in the adoption of this cutting-edge technology.

 

The move to 2nm is strategically crucial for MediaTek, allowing it to compete directly with rivals like Qualcomm, which is also expected to adopt TSMC’s 2nm process for its upcoming Snapdragon 8 Elite Gen 3 chip in 2026. This race to the forefront of semiconductor technology is further fueled by Xiaomi’s recent launch of its in-house 3nm XRING 01 chip, highlighting the industry’s rapid pace of innovation.

 

TSMC’s 2nm process promises significant performance improvements. It is expected to deliver up to a 45% reduction in power consumption compared to 5nm technology, while simultaneously increasing transistor density and performance. Innovative backside power delivery further enhances efficiency, potentially boosting voltage management by 30% and frequency performance by 6%. These advancements are vital for both high-performance mobile devices and demanding AI applications.

 

MediaTek’s commitment to utilizing TSMC’s most advanced nodes, including future generations beyond 2nm, solidifies its position as a key player in the global semiconductor landscape. This ambitious move positions MediaTek not only for continued success in the smartphone market but also as a major force in the rapidly expanding field of AI.

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