Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Semiconductor Packaging has become a critical factor to any semiconductor company success. Engineers have to select a semiconductor package effectively to both meet demanding price pressure but also system level performance requirements and size limitations.
Furthermore, with today’s price pressures – companies are spending more time in finding, selecting,
Antenna in Package (or AiP) is an new trend in IC packaging which is an enabler of smaller and high integrated ICs that consists of ICs and Antenna inside a package. Antenna in Package allows integration of all the complex RF components, together with the base-band circuitry into a complete
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TowerJazz, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc. (NASDAQ:MXIM). This acquisition will expand TowerJazz’s current worldwide manufacturing capacity, cost-effectively increasing its production by about 28,000 wafers per month. The availability of
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According to sources, chipmaker Qualcomm is laying off today a few dozen of employees in the company’s development center in Israel. The layoffs are part of a worldwide cutback of 15% of its total work force that was announced by the company in July 2015 to help the company save
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This is a high level article for those who are debating whether to use FPGAs or ASICs and need some technical and commercial insight to help ease the decision process. Both technologies, ASICs and FPGAs are absolutely fantastic and have great benefits but it’s up to you to figure out,
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Consumerism of electronic products is driving the SoC companies to tape out multiple variants of products every year. Demand for faster, low power, more functionality and interoperability is forcing the industry to come up with standard solutions for different interfaces on the SoC. In past couple of years, tens of new protocols have
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Necessity is the mother of invention. For the semiconductor industry, the emergence of Multi-Project Wafers (MPWs) is no exception to the rule. This fundamental enabler of affordable IC fabrication emerged in the 1970’s to help university researchers and silicon entrepreneurs prototype their Integrated Circuits (ICs) and demonstrate their work. It
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On a yearly basis, AnySilicon provides a snapshot of top semiconductor foundries wafer capacity, based on available data on their website. In our last yearly report , we have presented semiconductor foundries capacity ranking of the top 4 pure-play wafer fabs: TSMC, GLOBALFOUNDRIES, UMC and SMIC. This year, our report has
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IP cores availability and quality have become a critical factor to any SoC design success. Engineers have to find and qualify different IP cores quickly and effectively to help boost time to market and reduce the need of unnecessary re-spins. Moreover, with today’s aggressive time to market demands and the
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The semiconductor industry was a bit puzzled last year when Amazon acquired Annapurna Labs (Israel) for $350 million; the analysts believed that Amazon is planning to use Annapurna’s chips in its own data centers. But now it turns out that Amazon is taking advantage of the deal to enter the
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