Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
September 13, 2024 — Enosemi, a silicon photonics chiplet and IP provider, announced today the availability of a portfolio of high-speed electronic and photonic design IP in the GF Fotonix(TM) IP catalog. The silicon-proven design IP enables Fotonix users to accelerate their time-to-market for next-generation photonic integrated circuits. Enosemi has multiple
Read More
Vanguard International Semiconductor Corp (VIS) and Episil Technologies Inc. announced today a strategic partnership to build an 8-inch silicon carbide (SiC) wafer fabrication facility in Taiwan. The collaboration, facilitated by an equity acquisition deal, will see VIS acquire a 13% stake in Episil for NT$2.48 billion (US$77.1 million).
The
This weeks, Taiwan’s foundries and OSAT’s reported their August revenue. TSMC showing very strong year on year (YoY) growth due to it’s dominance of advanced technology for AI and smartphone applications.
TSMC Dominates with Advanced Technology
TSMC, the world’s largest contract chipmaker, reported August revenue of US$7.8 billion, a
Meyreuil, France – September 12th – Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, proudly announces becoming member of the MEDICALPS cluster. This initiative is part of Presto Engineering’s ongoing commitment to understanding the challenges and needs of medical device companies, ensuring continued
Read More
Okmetic is currently building a fab expansion, that will more than double our Vantaa site capacity. The fab expansion will be in operation in 2025 and focus on 200 mm crystal growth as well as 200 mm SSP and DSP wafers.
Vantaa site in summer 2024
In addition
Today, GaN is set to be an indispensable technology for power and RF applications in the coming years. Established Si and SiC companies are eager to enter this emerging market, but moving from innovation to mass production raises significant challenges. Last June, Ezgi Dogmus from Yole Group, along with
Read More
CAMPBELL, Calif., Sept. 10, 2024 — Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that VeriSilicon (688521.SH), a one-stop custom silicon service and semiconductor IP licensing service provider, has licensed Arteris FlexNoC 5 interconnect IP. This physically aware interconnect IP offers enhanced
Read More
Munich, Germany and Villach, Austria – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to
Read More
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services – design,
Read More
September 9th 2024, SILICON VALLEY, Calif. and MALTA, N.Y., September 9, 2024 – GlobalFoundries (Nasdaq: GFS) (GF) and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP). The partnership will
Read More