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ATLANTA, GA, November 28, 2024 — Silicon Creations, a global leader in high-performance analog and mixed-signal intellectual property (IP) is pleased to announce a strategic partnership with Interex Semiconductor. Through this collaboration, Interex Semiconductor will serve as the sales representative for Silicon Creations’ full portfolio of IP solutions across India, providing
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Shanghai, China – November 29, 2024–VeriSilicon (688521.SH) today announced a strategic partnership with LVGL, the leading open-source graphics library for embedded systems, to support VeriSilicon’s low-power 3D and VGLite 2.5D GPU technology within the LVGL library. This partnership aims to optimize performance and expand graphic processing capabilities for a wide
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GlobalFoundries (GF), a leading semiconductor manufacturer, has been awarded up to $1.5 billion in funding under the US CHIPS and Science Act. This significant investment, part of GF’s larger $13 billion plan to expand its US production capacity over the next decade, will bolster domestic chip production and address critical
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OpenAI CEO Sam Altman is leading a $150 million funding round for Rain AI, a semiconductor startup aiming to rival Nvidia’s dominance in the AI chip market. This investment, valuing Rain AI at $600 million, follows a $25 million seed round in 2022 where Altman was a major investor. Rain
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BRANFORD, Conn. and BLOOMINGTON, Minn. – November 20, 2024 – Quantum-Si Incorporated (Nasdaq: QSI) (“Quantum-Si,” or “QSI”), The Protein Sequencing Company™ and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced today they will jointly expand their relationship to support the development of Proteus, Quantum-Si’s next-generation platform designed to transform proteomic research.
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Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence’s commitment to driving industry-leading solutions through its chiplet architecture and framework.
The First System Chiplet
In a significant leap forward,
Embedded non-volatile memories (eNVM) are memory blocks that are directly integrated semiconductor fabrication on the same die. Since eNVM memories are non-volatile, the data is retained even when the power is off. In addition, eNVMs are reprogrammable and erasable multiple times. Compared to external non-volatile memory technologies, eNVMs have lower
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Migdal Haemek, Israel – November 13, 2024 – Tower Semiconductor (NASDAQ: TSEM & TASE: TSEM) today announced its financial results for the third quarter ended September 30, 2024, reporting continued growth and a significant investment in future capacity.
Third Quarter Highlights:
Revenue reached $371 million, a 6% increase
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Woodcliff Lake, New Jersey — November 19, 2024—Semiconductor intellectual property provider CAST, in collaboration with Silesia Devices, today announced a new IP core that implements the Serial Peripheral Interface for Automotive Safety (SafeSPI), an emerging open standard that adds Functional Safety and interoperability features to the de-facto Serial Peripheral Interface
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Introduction to Gate-All-Around (GAA) Transistors
Gate-all-around (GAA) transistors are a newly introduced type of transistor structure: the gate terminal connects with the channel on all sides. Gate-All-Around transistors are a multi-gate field effect transistors type where a silicon nanowire gate moves around the channel by further scaling down FinFET. The