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Newark, Aug. 12, 2024 (GLOBE NEWSWIRE) — The report published by The Brainy Insights shows that the global discrete semiconductor market is expected to reach USD 44.2 billion by 2033, at a CAGR of 6% during the forecast period 2023-2032. North America emerged as the largest market for global discrete semiconductors,
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SANTA CLARA, Calif. – August 13, 2024 – Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced a strategic investment from VentureTech Alliance.
The additional funding puts Eliyan’s total investment past the $100 million mark and will help further the company’s
WASHINGTON—August 5, 2024—The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024. Sales in June 2024 were $50.0 billion, an
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MILPITAS, Calif. — August 1, 2024 — Worldwide silicon wafer shipments increased 7.1% quarter-over-quarter to 3,035 million square inches (MSI) in the second quarter of 2024 but saw an 8.9% decline from the 3,331 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its
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Second Quarter 2024 Highlights [1]:
Revenue of NT$2,649 million (US$82.8 million)
Gross margin was 47.1%
Net income attributed to stockholders of the parent was NT$261 million (US$8.2 million)
Earnings per share of NT$1.00
【Hsinchu, Taiwan】 Jul. 30, 2024
Faraday Technology Corporation (“Faraday” or the “Company”) (TWSE: 3035),
According to Yole Group, in the Advanced Packaging Market Monitor Q2 2024, advanced packaging revenue reached US$10.2 billion in Q1 2024. This quarter is anticipated to be the weakest of the year, with an 8.1% revenue decline from the previous quarter due to the seasonality that typically impacts the back-end business
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its MIPI D-PHY and V-by-One (VBO) PHY IP portfolios now support processes that range from 55nm to 22nm on UMC platform. Faraday has shipped over 100 million video interface IP solutions for AIoT, industrial,
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Avnet ASIC, a division of Avnet Silica, an Avnet company (NASDAQ: AVT), today announced that it has launched its new ultra-low-power design services for TSMC’s cutting-edge 4nm and below process technologies. These services are designed to enable customers to achieve exceptional power efficiency and performance in their high-performance applications, such as blockchain
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NOIDA, India, May 27, 2024—HCLTech, a leading global technology company, and Arm, a leading technology provider of processor IP, announced their collaboration to augment custom silicon chips that support AI-driven business operations.
The partnership will bring to market solutions that enable semiconductor manufacturers, system OEMs and cloud services providers to enhance the
Place and route is an important part of the ASIC design flow and act as both mapmaker and builder within the silicon landscape, determining where components reside and how they connect while meeting stringent technical requirements. Its role is pivotal; without effective practices here, the most innovative chip designs could
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