Chiplet Market set to Reach $411 Billion by 2035

[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology, Opportunities, Applications,” from HomeResearch reveals the burgeoning chiplet market is projected to skyrocket to US$411 billion by 2035. This transformative technology is revolutionizing the semiconductor industry by offering a modular and efficient alternative to traditional monolithic System-on-Chip (SoC) designs.

Authored by Dr. Xiaoxi He and Dr. Yu-Han Chang, the report delves into the key drivers behind this explosive growth. The slowing of Moore’s Law has spurred the need for innovative solutions to enhance performance and functionality without simply increasing transistor density. Chiplets, with their modular architecture and ability to integrate diverse functionalities, provide a compelling answer.

Key Findings:

• Market Size: The chiplet market is projected to reach a staggering US$411 billion by 2035.
• Driving Forces: The slowdown of Moore’s Law, the need for enhanced function density, and the increasing focus on system-level integration are fueling the adoption of chiplet technology.
• Key Advantages: Chiplets offer improved supply chain resilience, enhanced manufacturing yields, reduced costs, and increased design flexibility. Their modularity allows for easier integration of diverse functionalities tailored to specific applications.
• Challenges and Opportunities: While offering significant advantages, chiplets present challenges in advanced interconnection technologies, thermal management, and the need for innovative materials. These challenges, however, create opportunities for various players in the supply chain.
• Comprehensive Analysis: The report provides a detailed analysis of chiplet technology, manufacturing processes, inter-chiplet communication, thermal management strategies, and various application areas across diverse sectors. A 10-year market forecast segmented by application is also included.

The report highlights the innovative approaches being employed by companies like AMD and Intel, showcasing the real-world applications and potential of chiplet technology. It also examines the complex interplay between chiplet design, advanced packaging techniques, and the evolving landscape of the semiconductor industry. Read the full report here.