Semiconductor Latest News

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Demonstrating DB HiTek Chips Integrating Weebit ReRAM at PCIM 2025

HOD HASHARON, Israel and SEOUL, South Korea – May 1, 2025 – Weebit Nano Limited (ASX:WBT) (Weebit), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and tier-1 semiconductor foundry DB HiTek will show the first demonstration of DB HiTek’s Bipolar-CMOS-DMOS (BCD) silicon integrating Weebit’s

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Imec coordinates EU Chips Design Platform

LEUVEN (Belgium), 29 April, 2025 — A consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform. Funded by Chips JU, the platform will facilitate access to advanced semiconductor design infrastructure, training, and capital for fabless semiconductor

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Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports

MILPITAS, Calif. — April 29, 2025 — Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry. Sequentially, shipments

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SkyeChip Joins Intel Foundry Accelerator IP Alliance

press release

Penang, Malaysia, 30 April 2025 –– SkyeChip Berhad, a Malaysian integrated circuit (IC) design company specialising in high-performance silicon IP, has announced its participation in the Intel Foundry Accelerator IP Alliance. This strategic collaboration enables the company to support Intel Foundry customers by delivering high-quality IP optimised for Intel Foundry’s

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X-FAB First Quarter 2025 Results

April 29-2025 — TESSENDERLO-HAM, Belgium-Regulatory News:
X-FAB (BOURSE:XFAB):
 
Highlights Q1 2025:

Revenue was USD 204.1 million, down 6% year-on-year (YoY) and up 8% quarter-on-quarter (QoQ)
Excluding the impact from revenue recognized over time (IFRS 15), revenue was USD 202.3 million, well within the guided range of USD 195-205 million
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STMicroelectronics Published Q1 2025 Financial Results

STMicroelectronics has announced its financial results for the first quarter of 2025, reflecting both the challenges of a shifting market and the company’s strategic transformation efforts.

 
This memo summarizes STMicroelectronics’ Q1 2025 financial results, as announced. While revenues were down 27.3% year-over-year to $2.52 billion, aligning with

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Intel Expands Foundry Ecosystem With TSMC, UMC, and Taiwanese IP Partners

Intel’s new CEO, Lip-Bu Tan, concluded his first earnings call, signaling a strong commitment to the company’s transformation. This transformation includes a strategic blend of internal manufacturing and external partnerships, notably with TSMC. Intel’s upcoming Nova Lake CPU will leverage both Intel’s own fabs and TSMC’s manufacturing capabilities, optimizing production

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The Future of Semiconductors: A Deep Dive with Scott Bulbrook

This interview features Scott Bulbrook, President of DA-Integrated.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services

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New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity

press release

Woodcliff Lake, New Jersey — April 29, 2025 — Semiconductor intellectual property core provider CAST today introduced a high-performance Audio Sample Rate Converter (ASRC) IP core that delivers real-time and batch-mode sample rate conversion with exceptional signal integrity, ultra-low distortion, and unmatched scalability. The company believes the new Audio Sample

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UCIe™ — Universal Chiplet Interconnect Express

chiplet

UCIe, is a pivotal player in modern chip design that places emphatic power on high-bandwidth data transfer, efficient heat management, and reduced leakage. This standard features bioinspired advancements, system co-optimization, and integration with cutting-edge 3D packaging, which together revolutionize AI, high-performance computing, and consumer electronics. Alongside optical I/O advancements, UCIe

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