Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to
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This interview was held with Michael Dube, Executive Vice President of Manufacturing Operations and Engineering of Rochester Electronics.
Tell me a bit about your background? How did you first get started with Rochester Electronics?
Sure, let me share a bit about my journey. I kicked off my
Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology. This innovative SoC seamlessly integrates Arm® Neoverse™ Compute Subsystems (CSS), delivering unparalleled performance and power efficiency
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MILPITAS, CALIFORNIA, UNITED STATES, February 2, 2024 — SignatureIP, the pioneer of next generation NoC tools, has launched its new iNoCulator™ NoC configuration tool with a free trial period of two weeks for customers. The NoC (Network on Chip) is the backbone of a chip that provides the interconnect infrastructure between
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MILPITAS, CALIFORNIA, UNITED STATES, January 31, 2024 — Marquee Semiconductor, a global leader in chip design solutions, announces it has brought on semiconductor industry veteran Gideon Intrater as a Strategic Advisor. Mr. Intrater brings to Marquee more than 30 years of experience gained through technical, marketing and sales leadership roles at
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SANTA CLARA, Calif. – January 31, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures, achieving bandwidth of 64Gbps/bump on a 3nm process using standard packaging. The
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SANTA CLARA, Calif., and TAIPEI, Taiwan, ROC, Jan. 25, 2024 – Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile,
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Since mid of last year, our member ESPAT-Consulting is dedicating significant resources to SEMI Europe GmbH in Berlin, Germany, as one of the seven consortium core members of the EU CHIPS ACT driven Horizon Europe – Chips Joint Undertaking (JU) – Coordination and Support Action (CSA) – Project Pack4EU (Link: https://pack4eu.eu/). He is asking
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SAN RAMON, CA, 94582 — January 17, 2024 — YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona. The Semidynamics High-Performance High-Bandwidth Quad Core IP with 4 Atrevido 423 with V8 SMD VPUs and T16 SMD Tensor
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TEMPE, Ariz.–(BUSINESS WIRE)–Jan. 16, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.
Since February 2023, GF