Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
By Christos Kasparis, EnSilica
EETimes (May 15, 2024)
The rise of quanum computing paints a significant challenge for the cryptography we rely on today. The modern encryption standards we currently use to safeguard sensitive data and communications, such as DSA, public key RSA and those based on elliptic curves,
In this guide, we’ll delve into what exactly embedded die packaging is, exploring its definition, and the myriad of benefits it provides across various applications. From space-saving designs to improved heat dissipation, this innovative approach to integrating semiconductor dies is pivotal for modern electronics.
Image courtesy: ASE
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AnySilicon, the leading platform for ASIC service providers, is delighted to announce its partnership with Avnet ASIC Israel, a distinguished leader in semiconductor design, manufacturing solutions and TSMC VCA. By joining AnySilicon, Avnet ASIC Israel gains access to a comprehensive suite of marketing promotion services aimed at showcasing its offerings,
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Jun. 5, 2024 —- On June 5th, Vanguard and NXP announced plans to jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a 12-inch wafer plant. TrendForce posits that this move reflects the trend of global supply chains shifting “Out of China, Out of Taiwan”(OOC/OOT), with Taiwanese companies accelerating
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Woodcliff Lake, New Jersey — June 4, 2024 — Semiconductor intellectual property provider CAST today announced a new IP core that implements a hardware decompression engine for the LZ4 and Snappy lossless data compression algorithms.
The new LZ4SNP-D LZ4/Snappy Data Decompressor IP core receives compressed data files, detects the
This interview was held with CoreHW’s VP of Sales and Marketing, Mr. Tomi Moilanen.
Can you provide an overview of CoreHW’s experience and expertise in IC design? What sets CoreHW apart in terms of its capabilities and track record in this field?
CoreHW, founded in Finland
Imagine a world where every moment is captured with immaculate clarity, from the delicate hues of a sunset to the swift action of a sporting event. The heart of this imagery revolution lies in the CMOS image sensor (CIS), a masterpiece of technology little known outside expert circles. Its evolution
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NORTH READING, MA / ACCESSWIRE / May 21, 2024 / Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test equipment, today announced shipment of its 8,000th J750 semiconductor test platform. This milestone has been achieved with V-Test, a leading outsourced semiconductor assembly and test (OSAT) vendor in China.
LEUVEN (Belgium), MAY 21, 2024 — This week, at its technology forum ITF World 2024, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, announces it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth,
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SANTA CLARA, Calif. — May 21, 2024— Expedera Inc., a leading licensor of edge inference artificial intelligence (AI) semiconductor intellectual property (IP), today announced it raised $20 million in Series B funding led by indie Semiconductor, with participation from prominent repeat and new industry investors. This investment, which includes converting
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